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The XCZU67DR-L1FFVE1156I is a Zynq UltraScale+ RFSoC System-on-Chip manufactured by AMD. It integrates a Processing System with four ARM Cortex-A53 cores and two ARM Cortex-R5 cores, alongside Programmable Logic and integrated RF data converters. The device operates at maximum clock frequencies of 500 MHz for the A53 cores and 1.2 GHz for the R5 cores. It utilizes a 1156-pin FCBGA package measuring 35x35 mm and supports an operating temperature range from -40°C to +100°C.
Verify component authenticity through authorized distribution channels or direct manufacturer engagement. Confirm RoHS3 compliance status and Moisture Sensitivity Level (MSL 4) requirements prior to assembly planning. Ensure export documentation is prepared if applicable, as this product may require additional files for international shipment depending on destination regulations.
Select this variant for applications requiring the L1 speed grade, which provides specific timing characteristics distinct from higher-speed options. The 1156-pin form factor suits designs needing substantial I/O density within a constrained footprint. Evaluate thermal management strategies carefully due to the high integration density of the RFSoC architecture.
This part belongs to the XCZU67DR series within the Zynq UltraScale+ RFSoC family. It shares the same physical package and core processor configuration with variants like XCZU67DR-1FFVE1156I and XCZU67DR-2FFVE1156I, differing primarily in the speed grade suffix which dictates maximum operational frequencies and timing constraints.
Direct pin-compatible substitutes include other speed grades within the XCZU67DR-FFVE1156I family, such as XCZU67DR-1FFVE1156I or XCZU67DR-2FFVE1156I, provided the system timing requirements align with their respective frequency specifications.