XCZU67DR-L1FFVE1156I

XCZU67DR-L1FFVE1156I

$17,477.06
  • Description:IC ZUP RFSOC A53 FPGA LP 1156BGA
  • Series:Zynq® UltraScale+™ RFSoC

SKU:d0505399a45d Category: Brand:

  
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Product Detailed Parameters

  • Description:IC ZUP RFSOC A53 FPGA LP 1156BGA
  • Series:Zynq® UltraScale+™ RFSoC
  • Mfr:AMD
  • Package:Tray
  • Architecture:MCU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:-
  • Connectivity:-
  • Speed:500MHz, 1.2GHz
  • Primary Attributes:Zynq® UltraScale+™ RFSoC
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:1156-BBGA, FCBGA
  • Supplier Device Package:1156-FCBGA (35x35)

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XCZU67DR-L1FFVE1156I

Overview

The XCZU67DR-L1FFVE1156I is a Zynq UltraScale+ RFSoC System-on-Chip manufactured by AMD. It integrates a Processing System with four ARM Cortex-A53 cores and two ARM Cortex-R5 cores, alongside Programmable Logic and integrated RF data converters. The device operates at maximum clock frequencies of 500 MHz for the A53 cores and 1.2 GHz for the R5 cores. It utilizes a 1156-pin FCBGA package measuring 35x35 mm and supports an operating temperature range from -40°C to +100°C.

Feature Summary

  • Integrated quad-core ARM Cortex-A53 MPCore and dual-core ARM Cortex-R5 processors with CoreSight debug support
  • Zynq UltraScale+ RFSoC architecture combining PS, PL, and RF subsystems on a single die
  • 1156-FCBGA (35x35 mm) package optimized for thermal performance in high-density designs

Applications

  • Software-defined radio systems requiring direct RF sampling
  • Radar signal processing platforms utilizing integrated ADC/DAC channels
  • High-performance embedded control systems demanding real-time processing capabilities

Procurement Notes

Verify component authenticity through authorized distribution channels or direct manufacturer engagement. Confirm RoHS3 compliance status and Moisture Sensitivity Level (MSL 4) requirements prior to assembly planning. Ensure export documentation is prepared if applicable, as this product may require additional files for international shipment depending on destination regulations.

Selection Notes

Select this variant for applications requiring the L1 speed grade, which provides specific timing characteristics distinct from higher-speed options. The 1156-pin form factor suits designs needing substantial I/O density within a constrained footprint. Evaluate thermal management strategies carefully due to the high integration density of the RFSoC architecture.

Part Context

This part belongs to the XCZU67DR series within the Zynq UltraScale+ RFSoC family. It shares the same physical package and core processor configuration with variants like XCZU67DR-1FFVE1156I and XCZU67DR-2FFVE1156I, differing primarily in the speed grade suffix which dictates maximum operational frequencies and timing constraints.

Replacement Considerations

Direct pin-compatible substitutes include other speed grades within the XCZU67DR-FFVE1156I family, such as XCZU67DR-1FFVE1156I or XCZU67DR-2FFVE1156I, provided the system timing requirements align with their respective frequency specifications.

XCZU67DR-L1FFVE1156IXCZU67DR-L1FFVE1156I
$17,477.06
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