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XP10N3R8S is listed in the Single FETs, MOSFETs range at ChipApex. The manufacturer field lists YAGEO XSEMI. Its product description is MOSFET N CH 100V 132A TO-263. Review the specifications below when checking this part for your BOM.
Single FETs, MOSFETs specifications for XP10N3R8S
- Description：MOSFET N CH 100V 132A TO-263
- Series：XP10N3R8
- Mfr：YAGEO XSEMI
- Package：Tape & Reel (TR)
- FET Type：N-Channel
- Technology：MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss)：100 V
- Current - Continuous Drain (Id) @ 25°C：132A (Tc)
- Drive Voltage (Max Rds On, Min Rds On)：10V
- Rds On (Max) @ Id, Vgs：3.88mOhm @ 60A, 10V
- Vgs(th) (Max) @ Id：4V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs：136 nC @ 10 V
- Vgs (Max)：±20V
- Input Capacitance (Ciss) (Max) @ Vds：6560 pF @ 80 V
- FET Feature：-
- Power Dissipation (Max)：3.12W (Ta), 125W (Tc)
- Operating Temperature：-55°C ~ 150°C (TJ)
- Grade：-
- Qualification：-
- Mounting Type：Surface Mount
- Supplier Device Package：TO-263
- Package / Case：TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Single FETs, MOSFETs datasheet and documents for XP10N3R8S
Single FETs, MOSFETs Overview
The XP10N3R8S is a single N-channel silicon MOSFET manufactured by YAGEO XSemi. It features a 100V drain-source breakdown voltage and a maximum continuous drain current of 45.5A. The device exhibits a low on-resistance of 3.88 milliohms, facilitating efficient power switching. It operates within an ambient temperature range of -55°C to +150°C and utilizes a TO-263 surface-mount package for thermal management.
Single FETs, MOSFETs Feature Summary
- High-efficiency power switching with ultra-low on-resistance
- Robust thermal performance in a standard surface-mount footprint
- Enhancement-mode operation for direct logic control
Single FETs, MOSFETs Applications
- DC-DC converter output stages
- Motor driver circuits
- Power supply load switches
Single FETs, MOSFETs Procurement Notes
Verify the specific suffix against the official datasheet to confirm pinout and electrical tolerances. Ensure the ordering code matches the required packaging format. Cross-reference the manufacturer part number with authorized distributors to prevent counterfeit components. Confirm RoHS compliance status if required by your assembly specifications.
Single FETs, MOSFETs Selection Notes
Select this component when high current handling and minimal conduction losses are critical. The TO-263 package offers a balance between current capacity and board space. Evaluate thermal resistance requirements based on the expected duty cycle and ambient conditions to ensure reliable operation under load.
Single FETs, MOSFETs Part Context
This part belongs to the XP series of power MOSFETs from YAGEO XSemi. The series focuses on providing optimized solutions for power management applications. The numbering convention typically indicates voltage class and resistance characteristics, aiding in quick identification within the broader transistor portfolio.
Single FETs, MOSFETs Replacement Considerations
Consult the official datasheet for exact pin-compatible alternatives. Verify that substitute parts meet or exceed the 100V rating and 3.88mOhm resistance specifications. Ensure thermal and mechanical dimensions match the existing PCB layout constraints.
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