XP3A010AMT

XP3A010AMT

$0.43
  • Description:MOSFET 2N-CH 30V 12A 8PMPAK
  • Series:XP3A010A

SKU:edd6fc8aa1bf Category: Brand:

  
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Product Detailed Parameters

  • Description:MOSFET 2N-CH 30V 12A 8PMPAK
  • Series:XP3A010A
  • Mfr:YAGEO XSEMI
  • Package:Tape & Reel (TR)
  • Technology:MOSFET (Metal Oxide)
  • Configuration:2 N-Channel
  • FET Feature:-
  • Drain to Source Voltage (Vdss):30V
  • Current - Continuous Drain (Id) @ 25°C:12A (Ta), 35A (Tc)
  • Rds On (Max) @ Id, Vgs:10.4mOhm @ 12A, 10V
  • Vgs(th) (Max) @ Id:3V @ 1mA
  • Gate Charge (Qg) (Max) @ Vgs:22.4nC @ 4.5V
  • Input Capacitance (Ciss) (Max) @ Vds:2448pF @ 15V
  • Power - Max:3.57W (Ta)
  • Operating Temperature:-55°C ~ 150°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:8-PowerLDFN
  • Supplier Device Package:8-PMPAK (5x6)
  • Grade:-
  • Qualification:-

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XP3A010AMT

Overview

The XP3A010AMT is a dual N-channel enhancement mode MOSFET manufactured by YAGEO XSemi using silicon technology. It features a PMPAK-8 (5x6) surface-mount package designed for high-current applications. Key electrical parameters include a drain-source voltage of 30 V and a continuous drain current of 12 A at ambient temperature, rising to 35 A at case temperature. The device exhibits a maximum on-resistance of 10.4 mOhms, with a gate-source voltage rating of 20 V and a threshold voltage of approximately 2.2 V. Power dissipation is rated at 3.57 W in air, supporting operation within a temperature range of -55°C to +150°C.

Feature Summary

  • Dual N-channel configuration integrated into a single compact package for space-constrained designs
  • Low on-resistance characteristic enabling efficient power handling and reduced thermal generation
  • Enhanced mode operation compatible with standard logic-level gate drive requirements

Applications

  • DC-DC converter output stages requiring low impedance switching
  • Motor driver circuits utilizing half-bridge or full-bridge topologies
  • Power distribution units managing high-current loads in industrial equipment

Procurement Notes

Verify the specific suffix designation against official manufacturer documentation to confirm exact binning and testing criteria. Ensure that the procurement channel provides traceable origin data compliant with RoHS directives. Confirm that the received components match the specified PMPAK-8 package dimensions and pinout configuration prior to integration into the final assembly process.

Selection Notes

Select this component when a dual N-channel topology is required within a limited footprint. The 10.4 mOhm on-resistance supports high-efficiency applications where conduction losses must be minimized. Consider the 3.57 W power dissipation rating relative to the available PCB copper area for adequate thermal management during continuous operation under load conditions.

Part Context

This part belongs to the XP series of power MOSFETs from YAGEO XSemi, which utilizes advanced silicon processing techniques. The series focuses on delivering cost-effective solutions with optimized performance metrics for modern power electronics. The dual configuration allows for simplified circuit design compared to using discrete single-channel devices.

Replacement Considerations

Direct substitutes require matching the 30V/12A dual N-channel specification and PMPAK-8 package. Verify that alternative parts maintain equivalent on-resistance and thermal characteristics to ensure system reliability without redesigning the thermal interface.

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