ZXMD63P03XTA

ZXMD63P03XTA

  • Description:MOSFET 2P-CH 30V 8MSOP
  • Series:-

SKU:cc5cb21f0b4f Category: Brand:

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Product Detailed Parameters

  • Description:MOSFET 2P-CH 30V 8MSOP
  • Series:-
  • Mfr:Diodes Incorporated
  • Package:Tape & Reel (TR)
  • Technology:MOSFET (Metal Oxide)
  • Configuration:2 P-Channel (Dual)
  • FET Feature:Logic Level Gate
  • Drain to Source Voltage (Vdss):30V
  • Current - Continuous Drain (Id) @ 25°C:-
  • Rds On (Max) @ Id, Vgs:185mOhm @ 1.2A, 10V
  • Vgs(th) (Max) @ Id:1V @ 250µA (Min)
  • Gate Charge (Qg) (Max) @ Vgs:7nC @ 10V
  • Input Capacitance (Ciss) (Max) @ Vds:270pF @ 25V
  • Power - Max:1.04W
  • Operating Temperature:-55°C ~ 150°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
  • Supplier Device Package:8-MSOP
  • Grade:-
  • Qualification:-

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ZXMD63P03XTA

Overview

The ZXMD63P03XTA is a dual P-channel enhancement mode MOSFET manufactured by Diodes Incorporated. It features a maximum drain-source voltage (V(BR)DSS) of -30V and a continuous drain current (ID) of -2.0A at 25°C. The device exhibits a low on-resistance (RDS(ON)) of 0.185Ω when the gate-source voltage (VGS) is -4.5V. Packaged in an MSOP-8 surface-mount configuration, it is designed for high-density applications requiring fast switching speeds.

Feature Summary

  • Combines low on-resistance with fast switching speed for high efficiency
  • Utilizes a unique structure to optimize performance in power management
  • Features a low profile MSOP package suitable for space-constrained designs

Applications

  • DC-DC Converters
  • Power Management Functions
  • Disconnect Switches
  • Motor Control

Procurement Notes

Verify component authenticity through authorized channels only. Confirm that the specific ordering suffix matches the required reel size and tape width specifications. Ensure compliance with RoHS standards as indicated in the manufacturer documentation before integration into production workflows.

Selection Notes

Select this component for low voltage power management circuits requiring dual P-channel configurations. Evaluate thermal resistance parameters against the expected ambient temperature conditions. Consider the MSOP-8 footprint constraints during PCB layout design to ensure adequate heat dissipation and mechanical stability.

Part Context

This part belongs to the ZXMD63 series of high-density MOSFETs from Diodes Incorporated. These devices are engineered to provide superior performance in compact packages compared to traditional discrete solutions. The series targets applications demanding efficient power handling within limited board areas.

Replacement Considerations

The datasheet explicitly states 'NO ALTERNATE PART'. No official substitutes are recommended by the manufacturer. Design modifications may be necessary if sourcing this obsolete component proves difficult.

ZXMD63P03XTAZXMD63P03XTA

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