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The trend of science and technology is changing rapidly.
TOKYO, July 31, 2026 — Renesas Electronics Corporation has officially announced a major domestic manufacturing restructuring, confirming plans to gradually discontinue all wafer fabrication operations at its Takasaki Factory located in Gunma Prefecture, Japan within the next two to three years.
While mass production will be completely phased out, Renesas confirms that related research and development activities will be maintained and strengthened. The exact shutdown schedule and final R&D site arrangement remain under review and will be disclosed once finalized.
The Takasaki facility operates aging 6-inch wafer production lines, focusing on the manufacturing of analog ICs and discrete power semiconductors. These components are widely used in automotive electronics, industrial control systems, and consumer devices worldwide.
According to the official statement, ongoing industry-wide supply chain changes have made legacy fab operations increasingly unsustainable. Key production materials, equipment spare parts, and long-term maintenance support for 6-inch wafer manufacturing systems are being gradually discontinued.
Combined with aging on-site equipment and facility infrastructure, stable long-term mass production has become difficult to guarantee, prompting Renesas’s strategic adjustment of its domestic production layout.
To avoid supply disruption and minimize impact on global clients, Renesas will actively adjust its production and inventory strategy during the transition period.
The company will evaluate market demand in advance and build sufficient strategic inventory to ensure stable delivery for existing orders and long-term customer contracts throughout the phased shutdown process. All manufacturing activities will be fully ceased before the official factory closure procedure is completed.
Renesas emphasized that the factory shutdown only applies to manufacturing businesses, not technical research and development.
The company plans to retain and upgrade its analog chip and power semiconductor R&D capabilities. The current Takasaki site and surrounding areas are listed as preferred candidate locations for future R&D bases. The upgraded research focus will cover automotive-grade semiconductors, power management ICs, and high-reliability industrial chip solutions.
This restructuring represents another key capacity adjustment among Japanese IDM manufacturers. Facing the upgrading of global semiconductor demand, traditional 6-inch legacy production lines are being gradually eliminated, while capital and resources are shifting toward high-value automotive, industrial, and new energy semiconductor products.
For global electronics buyers and procurement enterprises, the phase-out of Renesas’s Takasaki production line may bring lead-time fluctuations for partial analog and power discrete products. It is recommended to pay close attention to official follow-up updates, verify material supply cycles in advance, and deploy alternative component solutions to stabilize the supply chain.
Disclaimer: This article is compiled from public industry news for reference only. It does not represent the official statement of Renesas Electronics. All product and brand trademarks belong to their respective owners.
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