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— IC芯片 | 连接器 | 传感器 | 被动器件 —

Bipolar transistor arrays incorporate two or more discrete transistors in a shared package, either as electrically separate entities or with interconnections of some form between them being made inside the device package. Arrays in which the devices contained have closely matched or complementary characteristics, the co-packaged character minimizes temperature differences between devices during operation.
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
| Microchip Technology | TRANS 7NPN DARL 50V 500MA 16CDIP | Tube | 16-CDIP | Through Hole | - | 150°C (TJ) | |
| Microchip Technology | TRANS 7NPN DARL 50V 500MA 16CDIP | Tube | 16-CDIP | Through Hole | - | 150°C (TJ) | |
| Microchip Technology | TRANS 7NPN DARL 50V 500MA 20CLCC | Tray | 20-CLCC (8.89x8.89) | Surface Mount | - | -55°C ~ 125°C (TA) | |
| Microchip Technology | TRANS 7NPN DARL 50V 500MA 20CLCC | Tray | 20-CLCC (8.89x8.89) | Surface Mount | - | -55°C ~ 125°C (TA) | |
| Microchip Technology | TRANS 7NPN DARL 50V 16CERDIP | Tray | 16-CERDIP | Through Hole | - | -55°C ~ 125°C (TA) | |
| Microchip Technology | TRANS 7NPN DARL 50V 16CERDIP | Tray | 16-CERDIP | Through Hole | - | -55°C ~ 125°C (TA) | |
| Microchip Technology | TRANS 7NPN DARL 50V 16CERDIP | Tray | 16-CERDIP | Through Hole | - | -55°C ~ 125°C (TA) | |
| Microchip Technology | TRANS 7NPN DARL 50V 16CERDIP | Tray | 16-CERDIP | Through Hole | - | -55°C ~ 125°C (TA) |