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— IC芯片 | 连接器 | 传感器 | 被动器件 —
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— IC芯片 | 连接器 | 传感器 | 被动器件 —

Hard Metric, Standard Backplane Connectors conform to a set of specifications for interconnection devices. These devices are used in board or panel systems where other circuit boards can be plugged into. These connectors usually have a 2.0 mm pitch from row to row and column to column. The number of positions range from 3 (Power) to 308 (220 + 88 Ground) in Pitch dimensions 0.050” (1.27 mm), 0.071” (1.80 mm), 0.079” (2.00 mm), 0.150” (3.81 mm), or 0.295” (7.50 mm).
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
![]() HM2S30PD51M0N9LF $6.90 | Amphenol ICC (FCI) | 18MM STACK HT HM2 TYPE C, VERTIC | Tray | Through Hole | Millipacs® | ||
| Amphenol ICC (FCI) | 5R STR REC TYPC 0.76UGXT | Tray | Through Hole | Millipacs® | |||
| Amphenol ICC (FCI) | 5R STR REC TYPC 0.76UGXT | Tray | Through Hole | Millipacs® | |||
| Amphenol ICC (FCI) | MPAC STR HDR TYPA 1.25UAU | Tray | Through Hole | Millipacs® | |||
| Amphenol ICC (FCI) | 5R STR REC TYPC 0.76UGXT | Tray | Through Hole | Millipacs® | |||
| Amphenol ICC (FCI) | 5R STR REC TYPC 0.76UGXT | Tray | Through Hole | Millipacs® | |||
![]() HM2S30PE5100AALF $4.81 | Amphenol ICC (FCI) | CONN RECEPT 55POS 2MM PRESS-FIT | Tray | Through Hole | Millipacs® | ||
| Amphenol ICC (FCI) | MPACS 5R STR REC | Tray | Through Hole | Millipacs® |

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