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— IC芯片 | 连接器 | 传感器 | 被动器件 —
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— IC芯片 | 连接器 | 传感器 | 被动器件 —

Power driver modules provide the physical containment for power components, usually IGBTs and MOSFETs in a half bridge or one-, two- or three-phase configurations. Power semiconductors or dies are soldered or sintered on a substrate that carries the power semiconductors and provides electrical and thermal contact and electrical insulation where needed. Power modules provide a higher power density and are in many cases more reliable and easier to cool.
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
![]() STGIPS15C60-H $6.82 | STMicroelectronics | MOD IGBT SLLIMM 15A 600V 25SDIP | Tube | Through Hole | SLLIMM™ | ||
![]() STGIPS15C60T-H $13.00 | STMicroelectronics | MOD IPM SLLIMM 3PHASE 25SDIP | Tube | Through Hole | SLLIMM™ | ||
![]() STGIPS20C60 $8.50 | STMicroelectronics | MOD IPM SLLIMM 20A 600V 25SDIP | Tube | Through Hole | SLLIMM™ | ||
![]() STGIPS20C60-H $8.50 | STMicroelectronics | MOD IPM SLLIMM 20A 600V 25SDIP | Tube | Through Hole | SLLIMM™ | ||
![]() STGIPS20C60T-H $8.50 | STMicroelectronics | MOD IPM SLLIMM 3PHASE 25SDIP | Tube | Through Hole | SLLIMM™ | ||
| STMicroelectronics | IGBT IPM MODULE 17A 600V 25SDIP | Tube | Through Hole | SLLIMM™ | |||
![]() STGIPS30C60 $13.39 | STMicroelectronics | IGBT IPM MODULE 30A 600V SDIP-25 | Tray | Through Hole | SLLIMM™ | ||
![]() STGIPS30C60-H $13.39 | STMicroelectronics | MOD IPM SLLIMM 30A 600V 25SDIP | Tube | Through Hole | SLLIMM™ |

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