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— IC芯片 | 连接器 | 传感器 | 被动器件 —
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— IC芯片 | 连接器 | 传感器 | 被动器件 —

Power driver modules provide the physical containment for power components, usually IGBTs and MOSFETs in a half bridge or one-, two- or three-phase configurations. Power semiconductors or dies are soldered or sintered on a substrate that carries the power semiconductors and provides electrical and thermal contact and electrical insulation where needed. Power modules provide a higher power density and are in many cases more reliable and easier to cool.
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
| Infineon Technologies | MODULE IGBT 600V 10A 26PWRSIP | Tube | Through Hole | CIPOS™ | |||
| Infineon Technologies | POWER MODULE 600V 10A 26PWRSIP | Tube | Through Hole | CIPOS™ | |||
| Infineon Technologies | POWER MODULE 600V 6A MDIP30 | Tube | Through Hole | CIPOS™ | |||
![]() IM393S6E3XKLA1 $3.99 | Infineon Technologies | IM393S6E3 - CIPOS TINY 600 V, 6 | Bulk | Through Hole | CIPOS™ | ||
![]() IM393S6EXKLA1 $6.55 | Infineon Technologies | IM393 -S6 - CIPOS TINY 600V, 6A | Bulk | Through Hole | CIPOS™ | ||
| Infineon Technologies | MODULE IGBT 600V 6A 26PWRSIP | Tube | Through Hole | CIPOS™ | |||
| Infineon Technologies | POWER MODULE 600V 6A MDIP22 | Tube | Through Hole | CIPOS™ | |||
| Infineon Technologies | POWER MODULE 600V 20A MDIP30 | Tube | Through Hole | CIPOS™ |

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