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1-87220-0 is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists TE Connectivity AMP Connectors. Its product description is CONN HEADER VERT 10POS 2.54MM. Review the specifications below when checking this part for your BOM.
The 1-87220-0 is a vertical PCB header connector from the AMPMODU Mod II series, manufactured by TE Connectivity AMP Connectors. It features a single row with ten positions and a 0.100-inch (2.54mm) pitch. Designed for through-hole mounting, the contacts are made of phosphor bronze with gold plating to ensure reliable electrical performance. The housing is constructed from black thermoplastic material rated UL94 V-0 for flammability. This component supports a current rating of 3A and operates within a temperature range of -65°C to 105°C.
Verify that the specific part number matches the required ten-position configuration and vertical orientation. Confirm that the supplier provides components compliant with RoHS standards. Ensure the receiving inspection checks for physical integrity of the pins and housing before installation into the assembly process.
Select this component when a low-profile vertical header is required for dense PCB layouts. The 2.54mm pitch is standard for general wiring applications. Consider the 3A current rating and operating temperature limits to ensure compatibility with the target circuit's power and thermal requirements during operation.
This connector belongs to the AMPMODU Mod II family, a widely used line of rectangular connectors known for their versatility in various industrial and commercial applications. The series offers multiple configurations, including different pin counts and contact types, providing engineers with standardized solutions for reliable signal and power transmission across diverse electronic systems.
Compatible substitutes include other 10-position vertical headers with identical 2.54mm pitch and through-hole termination. Ensure mechanical dimensions and contact plating specifications match to maintain interchangeability without modifying the existing PCB footprint or assembly tooling.
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