1214GN-1200VG

1214GN-1200VG

  • Description:RF MOSFET HEMT 50V 55-Q11A
  • Series:VG

SKU:c9f10073ddc1 Category: Brand:

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Product Detailed Parameters

  • Description:RF MOSFET HEMT 50V 55-Q11A
  • Series:VG
  • Mfr:Microchip Technology
  • Package:Bulk
  • Technology:HEMT
  • Frequency:1.2GHz ~ 1.4GHz
  • Gain:17dB
  • Voltage - Test:50 V
  • Current Rating (Amps):-
  • Noise Figure:-
  • Current - Test:280 mA
  • Power - Output:1200W
  • Voltage - Rated:65 V
  • Grade:-
  • Qualification:-
  • Mounting Type:Surface Mount
  • Package / Case:55-Q11A
  • Supplier Device Package:55-Q11A
  • Configuration:-

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1214GN-1200VG

Overview

The Microchip Technology 1214GN-1200VG is a Common Source, Class AB GaN on SiC HEMT transistor designed for L-band radar applications. It delivers 1200 Watts of pulsed RF output power across the 1200 to 1400 MHz band with a 300μs pulse width and 10% duty factor. The device features internal pre-match circuitry, providing over 16.3dB gain and 53% drain efficiency at 50 Volts. Constructed with gold metallization and eutectic attach, it ensures high reliability and ruggedness in demanding environments.

Feature Summary

  • Internally matched Common Source Class AB GaN on SiC HEMT transistor
  • High-power pulsed RF output capability up to 1200 Watts
  • Gold metallization and eutectic attach for superior ruggedness
  • Integrated pre-match network for optimal performance

Applications

  • L-band pulsed primary radar output stages
  • High-power RF amplifier systems
  • Military and aerospace radar transmitters

Procurement Notes

Verify the specific revision level (Rev 2) against the latest official datasheet before procurement. Confirm that the ordering suffix matches the required package variant and ensure compatibility with the intended thermal management solution, as proper heatsink contact is critical for maintaining specified electrical characteristics and preventing oscillation.

Selection Notes

Select this component for applications requiring high-efficiency, high-power amplification in the L-band spectrum. Consider the 50V operating voltage and the necessity for precise gate bias control during turn-on and turn-off sequences. Evaluate the thermal resistance requirements and ensure the cooling system can handle the maximum power dissipation to maintain junction temperature within safe limits.

Part Context

This device belongs to Microchip's portfolio of Gallium Nitride (GaN) on Silicon Carbide (SiC) high-electron-mobility transistors (HEMTs). These components are engineered for high-frequency, high-power density applications where traditional silicon technologies may fall short in efficiency or thermal handling capabilities.

Replacement Considerations

No public confirmed substitute part numbers are available in the provided documentation.

FAQ

What is the recommended biasing sequence for the 1214GN-1200VG?

Turn ON: Set Vgs to -8V, increase Vds to 50V, then adjust Vgs until Idq reaches 280mA before applying RF input. Turn OFF: Reduce RF input, set Vgs to -8V, decrease Vds to 0V, and disconnect.

How should the transistor be mounted to ensure optimal performance?

Mount the unit in the middle of the slot, pushed to the drain side. Ensure the flange bottom surface has good contact with the heatsink slot using thermal compound to fill gaps, and apply symmetric force with 4-40 screws.

What is the maximum operating junction temperature?

The maximum operating junction temperature is +200°C.

1214GN-1200VG1214GN-1200VG

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