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1N4569 is listed in the Single Zener Diodes range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is DIODE ZENER 6.4V 500MW DO7. Review the specifications below when checking this part for your BOM.
The Microchip Technology 1N4569 is a 6.4 V temperature compensated Zener reference diode housed in a DO-7 (DO-204AA) glass axial-leaded package. It operates at a test current of 0.5 mA with a maximum voltage temperature coefficient of 0.0005%/°C and a dynamic impedance of 200 Ohms. The device supports an operating temperature range from -65°C to +175°C, features internal metallurgical bonding, and provides minimal voltage change over broad temperature ranges for precision instrumentation.
Verify the specific ordering suffix against official documentation to confirm exact tolerance, qualification level, and packaging configuration. Confirm that the selected variant matches the required military screening standards if applicable. Ensure the procurement specification aligns with the designated JEDEC registration and manufacturer datasheet requirements for this component series.
Select the 1N4569 when a nominal 6.4 V reference with ultra-low temperature coefficients is required. This component is suitable for applications needing operation at 0.5 mA test current. Consider tighter tolerance suffixes if specified voltage accuracy exceeds standard limits. Evaluate thermal management needs as power dissipation must remain below 30 mW for optimal stability.
This component belongs to the 1N4565 through 1N4584A-1 series of zero-TC reference diodes manufactured by Microsemi, now part of Microchip Technology. The series offers various operating currents and temperature coefficients centered around the 6.4 V nominal voltage. These devices are widely recognized for their reliability in high-stability analog circuit applications.
Direct replacements include other members of the 1N4565-1N4584 series with matching electrical characteristics. Surface mount equivalents are available via the UR-1 suffix in DO-213AA packages. Verify compatibility with existing board layouts and thermal constraints when substituting.
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