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2N4033UB is listed in the Single Bipolar Transistors range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is TRANS PNP 80V 1A UB. Review the specifications below when checking this part for your BOM.
The Microchip Technology 2N4033UB is a PNP silicon switching transistor qualified per MIL-PRF-19500/512. It operates with a collector-emitter voltage of 80 Vdc and a collector current of 1.0 Adc. The device features a total power dissipation of 0.5 W at +25°C ambient temperature, utilizing a surface mount package. Operating junction temperatures range from -65°C to +200°C. DC current gain (hFE) ranges from 25 to 300 depending on the collector current. Switching characteristics include a maximum storage time of 175 ns and fall time of 35 ns under specified test conditions.
Verify that the ordering suffix matches the required qualification level and package type. Confirm compliance with specific military or industrial standards if applicable. Ensure thermal derating calculations align with the intended ambient temperature conditions. Check for any recent product change notifications regarding assembly sites or packaging labels before finalizing procurement.
Select this component when a PNP transistor with high reliability and wide temperature operation is required. Consider the surface mount package constraints and thermal resistance values during layout. Evaluate the switching speed requirements against the documented dynamic characteristics. Ensure the drive circuitry can provide sufficient base current to achieve the desired saturation levels.
This device belongs to the 2N4033 family of PNP silicon switching transistors manufactured by Microchip Technology. It shares core electrical specifications with other variants like the 2N4033UA but differs in physical packaging. The UB designation specifically indicates the surface mount configuration suitable for automated assembly processes.
Direct substitutes include the 2N4033UA for equivalent electrical performance in a different package format. Verify pinout compatibility and thermal dissipation requirements when transitioning between package types.
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