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The Central Semiconductor Corp 2N5551 APP TIN/LEAD is an NPN silicon bipolar junction transistor (BJT) designed for through-hole mounting in a TO-92-3 package. It features a collector-emitter voltage (VCEO) of 160 V and a collector-base voltage (VCBO) of 160 V, with a maximum DC collector current of 500 mA. The device has a power dissipation rating of 625 mW and a transition frequency (fT) of 300 MHz. Operating temperatures range from -65°C to +150°C. The component includes a minimum DC current gain (hFE) of 40 at 10 V and 1 mA.
Verify the specific suffix 'APP TIN/LEAD' against the official datasheet to confirm lead material composition and plating specifications. Ensure the ordering code matches the required hermetic or non-hermetic variant if radiation hardness is critical. Confirm that the TO-92-3 package aligns with your PCB footprint requirements before finalizing procurement.
Select this component when high voltage isolation and moderate current handling are required in a small form factor. Consider the 160 V breakdown voltage for switching or amplification tasks exceeding standard low-voltage limits. Evaluate the thermal management needs given the 625 mW dissipation limit in the TO-92-3 package.
This part belongs to the 2N5551 series of NPN transistors manufactured by Central Semiconductor. The series is engineered for reliability in severe conditions, including radiation exposure. It serves as a robust alternative for general-purpose high-voltage switching and linear amplification where standard commercial grade parts may lack sufficient voltage margins.
Public confirmed substitute part numbers: SOC5551.