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2SC3507 is listed in the Single Bipolar Transistors range at ChipApex. The manufacturer field lists Panasonic Electronic Components. Its product description is TRANS NPN 800V 5A TOP-3F-A1. Review the specifications below when checking this part for your BOM.
The Panasonic 2SC3507 is a silicon NPN triple diffusion planar power transistor designed for high breakdown voltage and high-speed switching applications. It features a collector-base voltage (VCBO) of 1,000 V and a collector-emitter voltage (VCEO) of 800 V. The device supports a continuous collector current of 5 A and peak currents up to 10 A, with a maximum collector power dissipation of 80 W at 25°C case temperature. It utilizes the TOP-3F-A1 package, which allows direct mounting to heat sinks via a single screw.
Verify component authenticity through authorized distributors or official Panasonic channels. Confirm compliance with RoHS Directive (EU 2002/95/EC). Check current lifecycle status as maintenance or discontinued types may have limited availability. Ensure proper handling precautions are followed during storage and mounting to prevent electrostatic discharge damage.
Select this component for designs requiring high voltage isolation and fast switching speeds. Consider thermal management requirements given the 80 W dissipation rating. Verify that the operating junction temperature remains within -55°C to +150°C limits. Ensure base drive currents meet saturation requirements for optimal switching performance.
The 2SC3507 belongs to Panasonic's lineup of silicon NPN triple diffusion planar transistors. It is engineered specifically for applications demanding high breakdown voltage combined with rapid switching characteristics. The device complements other power transistors in similar voltage ranges while offering distinct thermal mounting advantages through its specialized package design.
Consult official Panasonic documentation for verified substitute part numbers. Cross-reference electrical parameters including VCBO, VCEO, IC ratings, and package dimensions before substitution. Verify compatibility with existing thermal management solutions and circuit driving requirements.
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