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2SC6096-TD-H is listed in the Single Bipolar Transistors range at ChipApex. The manufacturer field lists onsemi. Its product description is TRANS NPN 100V 2A PCP. Review the specifications below when checking this part for your BOM.
The onsemi 2SC6096-TD-H is a single NPN bipolar junction transistor housed in an SOT-89 surface-mount package. It features a collector-emitter voltage rating of 100V and a maximum collector current of 2A. The device offers a power dissipation capacity of 3.5W and a gain bandwidth product of 300MHz, with a maximum operating temperature of +150°C. Designed for high-voltage switching applications, it utilizes FBET and MBIT processes to achieve low collector-to-emitter saturation voltage and large current capacity.
Verify the specific suffix designation against official documentation, as ordering codes may indicate variations in taping specifications or reel configurations. Confirm component status, as availability data suggests this part number may be classified as obsolete by the manufacturer. Ensure that any substitute components meet the required electrical parameters and thermal characteristics for the intended application.
Select this component when high-voltage handling and rapid switching speeds are required within a compact surface-mount form factor. The SOT-89 package facilitates automated assembly while providing adequate thermal performance for moderate power levels. Consider the 100V breakdown rating and 2A current limit to ensure operation remains within safe boundaries for the target load conditions.
This device belongs to the 2SC6096 series of NPN transistors designed for robust performance in demanding environments. The series emphasizes efficiency through reduced saturation voltages and enhanced thermal stability. Variants within the family share core electrical characteristics but may differ in packaging or taping specifications to suit different manufacturing requirements.
Public confirmed substitutes include the 2SC6096-TD-E and the 2SC6098. Verify compatibility regarding package dimensions and pinout configuration before implementation.
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