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2SCR502UBTL is listed in the Single Bipolar Transistors range at ChipApex. The manufacturer field lists Rohm Semiconductor. Its product description is TRANS NPN 30V 0.5A UMT3F. Review the specifications below when checking this part for your BOM.
The 2SCR502UBTL is an NPN general-purpose amplification transistor manufactured by Rohm Semiconductor. It utilizes the UMT3F surface-mount package, corresponding to the SOT-323FL JEITA standard and SC-85 physical dimensions of 2.1x2.0 mm with a thickness of 1.05 mm. The device features a collector-emitter voltage (VCEO) rating of 30 V and a continuous collector current (Ic) capability of 0.5 A. DC current gain (hFE) ranges from 200 to 500. Power dissipation is rated at 0.2 W, with a storage temperature range spanning -55°C to 150°C.
Verify the specific ordering suffix against official Rohm documentation to confirm package type and tape-and-reel specifications. Confirm RoHS compliance status and supply status, as certain variants may be marked as not recommended for new designs. Ensure the procurement channel provides authentic datasheets matching the exact part number to avoid substitution errors with similar grades or packages.
Select this component when a compact NPN transistor with moderate current handling is required for space-constrained designs. The UMT3F package offers a balance between thermal performance and board area efficiency. Consider the complementary 2SAR502UBTL for push-pull configurations requiring matched electrical characteristics within the same product family.
This component belongs to Rohm's standard-grade general-purpose transistor lineup, emphasizing energy saving and high reliability. It is distinct from automotive-grade parts and is explicitly not recommended for use in automotive equipment. The product line focuses on providing various package options ranging from ultra-small to power types for diverse electronic design needs.
The 2SCR502U3HZG is documented as a similar specification replacement with the UMT3 package. Verify pin compatibility and hFE binning requirements before substituting.
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