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2SD1145F-AE is listed in the Single Bipolar Transistors range at ChipApex. The manufacturer field lists onsemi. Its product description is TRANS NPN 20V 5A 3-MP. Review the specifications below when checking this part for your BOM.
The 2SD1145F-AE is an NPN silicon small-signal transistor manufactured by onsemi. It is housed in a TO-92 plastic package with three pins. The device supports a maximum collector current of 0.5 A and a collector-emitter voltage rating of 80 V. It features a minimum DC current gain (hFE) of 25. The component operates within a junction temperature range of -55 °C to +150 °C, with total device dissipation rated at 1.0 W at 25 °C ambient temperature.
Verify the specific manufacturer source and authenticity before procurement. Confirm that the TO-92 package dimensions match the design requirements. Ensure the electrical ratings align with the target circuit conditions. Check for any specific handling or storage instructions provided by the supplier. Validate compliance with relevant regional standards if required for the final assembly.
Select this component when an NPN transistor with 80 V collector-emitter voltage and 0.5 A continuous current capacity is required. Consider the TO-92 package for through-hole mounting constraints. Evaluate the thermal dissipation capabilities relative to the expected operating temperature. Compare the hFE characteristics against the load requirements to ensure adequate drive capability.
This part belongs to the family of small-signal bipolar junction transistors designed for general electronic applications. It serves as a fundamental active component for signal processing and power control in consumer electronics and industrial equipment. The TO-92 form factor remains a standard choice for prototyping and low-volume production due to its ease of use and availability.
Consult official cross-reference lists for verified substitutes. Ensure replacement parts maintain identical pinout configurations and electrical specifications. Verify package compatibility to avoid mechanical integration issues. Confirm that alternative components meet the same reliability and environmental standards.
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