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2SD1153-AE is listed in the Single Bipolar Transistors range at ChipApex. The manufacturer field lists onsemi. Its product description is TRANS NPN DARL 50V 1.5A 3-MP. Review the specifications below when checking this part for your BOM.
The onsemi 2SD1153-AE is a single NPN bipolar junction transistor (BJT) configured in a Darlington topology. It is designed for high-gain switching and amplification applications within electronic circuits. The device features a maximum collector-emitter voltage of 50 V and supports a continuous collector current of 1.5 A. It operates with a transition frequency of 120 MHz, ensuring adequate performance for medium-speed signal processing tasks. The component dissipates up to 900 mW of power under specified thermal conditions. It is housed in a 3-MP through-hole package, facilitating integration into standard printed circuit board layouts requiring robust mechanical mounting.
Verify the specific ordering suffix against the manufacturer's official datasheet to ensure compatibility with required thermal and electrical specifications. Confirm that the 3-MP package variant matches the intended footprint and lead configuration for the target design. Cross-reference the part number with authorized distribution channels to guarantee authenticity and traceability of the semiconductor components.
Select this component when a high-current NPN switch with moderate voltage ratings is required. The Darlington structure provides significant current amplification, reducing base drive requirements compared to standard BJT configurations. Ensure the application does not exceed the 50 V collector-emitter limit or the 1.5 A current threshold. Consider thermal management strategies to maintain junction temperature within safe operating limits during continuous operation.
This component belongs to the family of single bipolar transistors manufactured by onsemi. It utilizes a Darlington pair architecture to achieve high current gain, distinguishing it from standard single-transistor BJT designs. The 3-MP package indicates a specific through-hole form factor suitable for industrial and consumer electronics assemblies where manual or wave soldering processes are employed.
Consult official cross-reference lists for verified substitutes. Generic equivalents may differ in gain characteristics or thermal resistance.
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