SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Schroff 30847608 is a static fill panel designed for rack mounting systems. It features a height of 3U and a width of 10HP, conforming to standard VME or Eurocard chassis dimensions. The component is manufactured from materials suitable for industrial enclosure applications. It serves as a blanking plate to cover unused slots in plug-in unit racks, ensuring proper airflow management and structural integrity within the assembly.
Verify the specific dimensional requirements against your chassis system before procurement. Confirm that the 3U height and 10HP width match your existing rack infrastructure. Check for any updated material change notices or RoHS compliance status directly from the manufacturer's official documentation to ensure regulatory adherence for your specific deployment region.
Select this component when a blanking plate is required for a 3U high by 10HP wide slot in a Schroff-compatible rack system. Ensure compatibility with the specific series of plug-in units being installed. Consider environmental factors such as EMI shielding requirements, noting that this specific part is designated as a static panel without specialized electromagnetic interference protection features.
This part belongs to the Schroff range of box accessories and rack components. It is categorized under panel enclosures and is intended for use with their line of plug-in units and chassis systems. The product supports modular rack configurations commonly found in telecommunications and industrial control applications.
Public confirmed substitute part numbers are not available in the provided documentation. Verify exact dimensional tolerances if considering alternative generic blanking plates.

TOKYO — Global leading semiconductor and power electronic components manufacturer Renesas Electronics officially issued a new price adjustment notice in early September 2026, confirming…
Read More
TOKYO, April 1, 2026 – Kioxia Corporation (formerly Toshiba Memory Corporation), a global leader in flash memory and storage solutions, has officially issued a…
Read More
Tokyo / Munich / Tessenderlo, December 24, 2025As the global semiconductor industry enters the first year of the 2nm process era, international electronic component…
Read More
Learn how rectifiers convert AC to DC, compare half-wave and bridge circuits, and select voltage, current, recovery and thermal ratings for your design.
Read More
In an era dominated by AI accelerators with terabytes of HBM memory and consumer devices racing toward LPDDR5X bandwidth, it’s easy to wonder: why…
Read More
An RF IC, or radio-frequency integrated circuit, is a chip that processes wireless signals between the antenna and the baseband processor. Instead of building…
Read More
The global memory market is entering an unprecedented supply-constrained phase as soaring demand from artificial intelligence (AI) infrastructure collides with strategic capacity reallocations by…
Read MoreWilmington, Mass. & Milpitas, Calif. – May 19, 2026 – Analog Devices, Inc. (NASDAQ: ADI), a global leader in high-performance analog and mixed-signal semiconductors,…
Read More
As the backbone of modern technology, electronic components are undergoing revolutionary changes, driven by advancements in materials science, miniaturization, and smart manufacturing. From ultra-efficient…
Read More
Recently, the global electronic component market has witnessed a series of new developments. The strategic layouts and market collaborations of major enterprises are constantly…
Read MoreNXP Semiconductors (NASDAQ: NXPI), a global leader in automotive, industrial, and IoT semiconductors, has officially notified customers of an upcoming price adjustment for select…
Read More
Embedded Integrated Circuit Modules: The Backbone of Modern Technology Embedded Integrated Circuit Modules (EICMs) have become an indispensable part of modern technology. Serving as…
Read More