329-10-151-00-560000

Headers, Male Pins Overview

The Mill-Max 329-10-151-00-560000 is a surface mount header connector featuring 15 positions with a 0.100-inch (2.54mm) pitch. Designed for through-board termination, it utilizes a single row of gold-plated contacts to ensure reliable signal transmission in compact electronic assemblies.

Headers, Male Pins Feature Summary

• Surface mount technology for automated PCB assembly
• Gold-plated contact surfaces for corrosion resistance
• Single row configuration for space-constrained layouts

Headers, Male Pins Applications

• Consumer electronics circuit boards
• Industrial control system interfaces
• Telecommunications equipment modules

Headers, Male Pins Procurement Notes

Verify the specific suffix codes against official Mill-Max documentation to confirm exact plating thickness and material specifications. Ensure compatibility with automated pick-and-place equipment by checking reel or tape packaging requirements. Cross-reference the pin count and pitch with design schematics to prevent insertion errors during manufacturing processes.

Headers, Male Pins Selection Notes

Select this component when surface mount assembly is required for high-density interconnects. The 2.54mm pitch accommodates standard wire gauges and mating connectors. Evaluate thermal management needs as surface mount headers may have different heat dissipation characteristics compared to through-hole variants.

Headers, Male Pins Part Context

This part belongs to the Mill-Max standard header series, which provides precision-machined interconnect solutions. The 329 series specifically targets surface mount applications, offering a low-profile alternative to traditional through-hole headers while maintaining robust mechanical stability and electrical performance.

Headers, Male Pins Replacement Considerations

Consult Mill-Max official substitution guides for direct equivalents. Verify that any alternative maintains identical pin count, pitch, and mounting style to ensure mechanical fit and electrical continuity without redesigning the PCB footprint.