350-40-137-00-106000

Headers, Male Pins Overview

The Mill-Max 350-40-137-00-106000 is a surface mount header connector featuring 37 positions with a 2.54mm pitch. It utilizes a single-row configuration and push-pull fastening mechanism. The contacts are gold-plated over nickel, ensuring reliable signal transmission. Designed for high-reliability applications, this component supports precise interconnection needs in compact electronic assemblies.

Headers, Male Pins Feature Summary

• Surface mount technology for automated assembly
• Gold contact plating for corrosion resistance
• Push-pull locking for secure mating

Headers, Male Pins Applications

• Industrial control systems
• Telecommunications equipment
• Medical instrumentation

Headers, Male Pins Procurement Notes

Verify the specific ordering suffix to confirm contact plating thickness and insulator material properties. Ensure compatibility with existing PCB footprint dimensions and reflow soldering profiles. Confirm that the single-row header design meets the required current carrying capacity for the intended circuit application before finalizing procurement orders.

Headers, Male Pins Selection Notes

Select this model when surface mounting is required for 37-position interconnects. The 2.54mm pitch allows standard spacing compatibility. Consider the push-pull retention feature if vibration resistance is critical. Evaluate the gold plating option against cost constraints and environmental exposure requirements for long-term durability.

Headers, Male Pins Part Context

This part belongs to the Mill-Max 350 series of precision machined interconnect components. The series is known for high reliability and customizability. As a header connector, it pairs with compatible socket or pin headers to establish electrical pathways in dense circuit board layouts.

Headers, Male Pins Replacement Considerations

Direct substitutes require matching 37 positions, 2.54mm pitch, and surface mount termination. Verify mechanical envelope dimensions and contact plating specifications to ensure functional equivalence without redesigning the host PCB layout.