464-10-212-00-580000

Headers, Male Pins Overview

The Mill-Max 464-10-212-00-580000 is a low-profile solder tail header featuring a double row configuration with 12 positions. It utilizes a 0.100-inch (2.54mm) pitch and employs a through-hole mounting type for secure PCB attachment. The component is designed as an unshrouded male-to-male header, suitable for standard interconnect applications requiring reliable signal transmission.

Headers, Male Pins Feature Summary

• Low-profile design optimized for space-constrained environments
• Double row arrangement providing increased pin density
• Through-hole solder tail termination for robust mechanical stability

Headers, Male Pins Applications

• General purpose electronic circuit interconnections
• Industrial control system board-to-board linking
• Telecommunications equipment signal routing

Headers, Male Pins Procurement Notes

Verify the specific ordering suffix to ensure compatibility with required contact plating and material specifications. Confirm that the through-hole footprint matches the target printed circuit board layout dimensions. Check RoHS compliance status against project requirements before finalizing procurement orders.

Headers, Male Pins Selection Notes

Select this component when a low-profile, double-row header is required for through-hole assembly. Ensure the 2.54mm pitch aligns with mating connector standards. Consider the unshrouded design for easy visual inspection of solder joints during manufacturing processes.

Headers, Male Pins Part Context

This part belongs to the Mill-Max 464 series, which specializes in low-profile headers. The series is known for precision-machined contacts and high reliability in demanding environments. It serves as a fundamental interconnect solution within the broader Mill-Max product portfolio.

Headers, Male Pins Replacement Considerations

Direct substitutes must match the 12-position count, double-row structure, and 2.54mm pitch. Verify that alternative components maintain the same through-hole mounting style and low-profile height constraints to ensure physical compatibility.