712-11-160-41-001000

Headers, Receptacles, Female Sockets Overview

The Mill-Max 712-11-160-41-001000 is a single in-line package (SIP) IC socket designed for through-hole mounting. It features 20 positions with a 0.100-inch (2.54mm) contact spacing. The contacts are gold-plated copper alloy, offering a mating surface thickness of 30 microinches and a pin surface thickness of 10 microinches. Rated for 3A current, it operates within a temperature range of -55°C to 125°C. The housing is constructed from PCT polyester, providing an open-frame design suitable for standard solder tail carrier applications.

Headers, Receptacles, Female Sockets Feature Summary

• Open-frame construction facilitates easy access and visual inspection during assembly.
• Gold-plated contacts ensure reliable electrical performance and corrosion resistance.
• Through-hole termination supports secure board attachment via standard soldering processes.

Headers, Receptacles, Female Sockets Applications

• Single in-line package integrated circuit testing
• Microcontroller prototyping and development
• Standard solder tail carrier configurations

Headers, Receptacles, Female Sockets Procurement Notes

Verify the specific contact count and row configuration against the target PCB footprint before ordering. Confirm that the required operating temperature range aligns with the component's specified limits. Ensure the soldering process parameters are compatible with the gold plating specifications to maintain connection integrity throughout the product lifecycle.

Headers, Receptacles, Female Sockets Selection Notes

Select this component when a single-row DIP interface is required for through-hole integration. Consider the 0.100-inch pitch compatibility with standard IC packages. Evaluate the mechanical stability provided by the open-frame design against space constraints on the target circuit board layout.

Headers, Receptacles, Female Sockets Part Context

This part belongs to the Mill-Max 712 series, which specializes in standard solder tail carrier sockets. These components are engineered for high-reliability interconnect solutions in electronic assemblies requiring durable through-hole connections for integrated circuits.

Headers, Receptacles, Female Sockets Replacement Considerations

Cross-reference alternative SIP sockets with identical 20-position counts and 2.54mm pitch. Verify that substitute parts match the through-hole termination style and gold plating requirements to ensure functional equivalence in existing designs.