71V3556S166PFGI8

Memory IC Overview

The Renesas Electronics Corporation 71V3556S166PFGI8 is a 4.5 Mbit (128K x 36) synchronous static random-access memory (SRAM) IC. It operates with a maximum clock frequency of 166 MHz and features a typical access time of 3.5 ns. The device utilizes a parallel interface and is powered by a 3.3 V supply, ranging from 3.135 V to 3.465 V. It is housed in a 100-TQFP package measuring 14x14 mm. This component supports Single Data Rate (SDR) operation and is designed for high-speed data handling applications requiring fast turnaround times.

Memory IC Feature Summary

• Eliminates dead bus cycles during read-to-write or write-to-read transitions
• Supports high-speed synchronous data transfer via ZBT technology
• Provides reliable storage for FPGA configuration and control systems

Memory IC Applications

• FPGA high-speed data handling
• Control system configurations
• Buffering in communication interfaces

Memory IC Procurement Notes

Verify current availability status as this part may be subject to discontinuation. Confirm package integrity and moisture sensitivity level upon receipt. Ensure compatibility with existing PCB footprints and voltage levels before integration into new designs.

Memory IC Selection Notes

Select this component when a 128K x 36 organization is required for wide-data bus applications. Consider the 166 MHz speed and 3.5 ns access time for latency-sensitive synchronous designs. Verify that the TQFP-100 package fits the mechanical constraints of the target assembly.

Memory IC Part Context

This SRAM belongs to the 71V3556 series, which includes variants like the CABGA-165 packaged 71V3556SA166BQGI8. The series is characterized by its Zero Bus Turnaround (ZBT) capabilities, offering improved performance over traditional asynchronous memories in synchronous systems.

Memory IC Replacement Considerations

The IDT71V3556S166BQG8 is an obsolete predecessor. The 71V3556SA166BQGI8 serves as a similar alternative but uses a different CABGA-165 package. Verify pinout and thermal requirements when substituting.