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A2G35S200-01SR3 is listed in the RF FETs, MOSFETs range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is RF MOSFET GAN HEMT 48V NI400. Review the specifications below when checking this part for your BOM.
The A2G35S200-01SR3 is a 40 W average power RF GaN transistor designed for cellular base station applications. It operates within the 3400 to 3600 MHz frequency range and utilizes a 48 Vdc drain supply. The device features high terminal impedances for optimal broadband performance and is optimized for Doherty amplifier configurations. It incorporates digital predistortion error correction capabilities. The component is housed in an NI-400S-2S package with dual N-channel configuration.
Verify the specific ordering suffix against current manufacturer documentation to confirm packaging details. Confirm RoHS compliance status through official datasheets prior to implementation. Ensure thermal management solutions align with the specified junction temperature limits and thermal resistance values provided in the technical data.
Select this component for wide instantaneous bandwidth requirements between 3400 and 3600 MHz. Evaluate compatibility with 48 Vdc supply rails and required quiescent current levels. Consider the need for robust thermal dissipation given the high power density and operating junction temperature specifications inherent to GaN technology.
This part belongs to the Airfast series of RF power GaN transistors from NXP Semiconductors (formerly Freescale). These devices are engineered for high-efficiency radio frequency power amplification in telecommunications infrastructure, emphasizing linearity and broadband capability.
Consult official substitution guides for equivalent Airfast series components. Verify pinout compatibility and electrical parameter alignment before considering alternative part numbers.
Performance is guaranteed for applications operating in the 3400 to 3600 MHz band.
Set VGS to pinch-off voltage, apply nominal VDS supply, then increase VGS to attain IDS current before applying RF input power.
The maximum forward gate current is 25 mA at a case temperature of 25°C.
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