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ADC1175CIMTCX/NOPB is listed in the Analog To Digital Converters (ADC) range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC ADC 8BIT TWO-STEP 24TSSOP. Review the specifications below when checking this part for your BOM.
The ADC1175CIMTCX/NOPB is an 8-bit, high-speed analog-to-digital converter manufactured by Texas Instruments. It operates with a sampling rate of 20 MHz and consumes 60 mW of power. The device utilizes a flash architecture to achieve rapid conversion times suitable for broadband applications. It supports a single-ended input configuration and communicates via a parallel interface. The component is housed in a 28-pin TSSOP package and functions within a supply voltage range of 4.75 V to 5.25 V. It is rated for operation between -40°C and +85°C.
Verify the specific suffix 'X' indicates tape-and-reel packaging when sourcing. Confirm RoHS compliance status through official manufacturer documentation. Ensure the operating temperature range meets system requirements. Check for lead-free certification details on the datasheet. Validate pinout compatibility with existing PCB layouts before integration.
Select this component when an 8-bit resolution at 20 MHz is sufficient for the application. Consider the parallel interface complexity compared to serial alternatives. Evaluate power budget constraints given the 60 mW dissipation. Assess thermal management needs for the TSSOP-28 package. Compare performance against higher-resolution SAR ADCs if speed is less critical than precision.
This part belongs to the ADC1175 family of high-speed ADCs from Texas Instruments. It succeeds earlier National Semiconductor designs under the same model number. The device represents a transition point in TI's portfolio following their acquisition of National Semiconductor. It serves as a bridge between legacy flash architectures and modern mixed-signal solutions.
The ADC1175CIMTC/NOPB is a tube-packaged equivalent of the same functional device. Verify pin compatibility and electrical specifications before substitution. Ensure the packaging difference does not impact assembly processes.
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