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AOTF600A70L is listed in the Single FETs, MOSFETs range at ChipApex. The manufacturer field lists Alpha & Omega Semiconductor Inc.. Its product description is MOSFET N-CH 700V 8.5A TO220F. Review the specifications below when checking this part for your BOM.
The AOTF600A70L is a through-hole N-channel power MOSFET from Alpha & Omega Semiconductor, utilizing proprietary aMOS5 technology. It features a drain-source breakdown voltage of 700V and a maximum pulsed drain current of 34A. The device has a maximum on-resistance of 0.6 ohms at VGS=10V and ID=4A. Key dynamic parameters include a total gate charge of 15.5nC and a body diode reverse recovery time of 245ns. It operates within a junction temperature range of -55°C to 150°C and is housed in a TO-220F Green Tube package.
Verify the specific ordering suffix matches the required package type, as the datasheet lists multiple variants including TO-220 and TO-263. Confirm RoHS compliance status directly with the manufacturer or authorized distributors prior to procurement. Ensure the component is suitable for the intended thermal management design given the specified junction-to-case thermal resistance values.
Select this component for applications requiring high-voltage handling up to 700V with moderate current capabilities. Consider the 0.6 ohm on-resistance for conduction loss calculations at 10V gate drive. Evaluate the 15.5nC gate charge against driver capability requirements. Verify that the TO-220F package fits the mechanical constraints of the target PCB layout.
This part belongs to the aMOS5 series of superjunction MOSFETs designed for high-efficiency power conversion. It shares the same die and electrical characteristics with surface-mount variants like the AOB600A70L and standard TO-220 packages, differing primarily in the lead frame configuration and mounting style provided by the TO-220F Green Tube packaging.
Direct functional equivalents are available in other packages such as AOT600A70L (TO-220) and AOB600A70L (TO-263). Cross-referencing requires verifying pinout compatibility and ensuring the replacement package meets the thermal dissipation requirements of the original design.
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