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Product Detailed Parameters
- Description：IGBT MOD 600V 220A 536W ISOTOP
- Series：-
- Mfr：Microchip Technology
- Package：Tube
- IGBT Type：Trench Field Stop
- Configuration：Single
- Vce(on) (Max) @ Vge, Ic：1.85V @ 15V, 150A
- Input：Standard
- NTC Thermistor：No
- Operating Temperature：-55°C ~ 175°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：ISOTOP
- Supplier Device Package：ISOTOP®
- Voltage - Collector Emitter Breakdown (Max)：600 V
- Current - Collector (Ic) (Max)：220 A
- Power - Max：536 W
- Current - Collector Cutoff (Max)：25 µA
- Input Capacitance (Cies) @ Vce：9.2 nF @ 25 V
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Overview
The APT150GN60J is a single IGBT module manufactured by Microchip Technology, utilizing silicon fieldstop technology. It features a maximum collector-emitter voltage (VCEO) of 600 V and is housed in an SOT-227-4 package with screw mount installation. The component operates within a temperature range of -55°C to +150°C TJ. Key electrical characteristics include a continuous collector current of 150 A at 25°C, a collector-emitter saturation voltage of 1.7 V, and a gate-emitter leakage current of 600 nA. The module supports a maximum power dissipation of 625 W and has a maximum gate-emitter voltage rating of 30 V.
Feature Summary
- Fieldstop technology for optimized switching performance
- Single configuration suitable for high-power applications
- Screw mount design for robust mechanical stability
Applications
- Low frequency power conversion systems
- Industrial motor drives
- Inverter circuits
Procurement Notes
Verify the specific datasheet revision and manufacturing date code upon order confirmation. Confirm that the SOT-227-4 package dimensions match the target PCB or heatsink interface requirements. Ensure thermal management solutions are compatible with the specified 625 W power dissipation limit under intended operating conditions.
Selection Notes
Select this component when a 600 V rated single IGBT with 150 A continuous current capability is required. Consider the SOT-227-4 package constraints for board space and mounting hardware. Evaluate thermal resistance values against the system's cooling capacity to ensure junction temperatures remain within the +150°C maximum limit during peak load operations.
Part Context
This part belongs to the APT series of discrete and module IGBTs from Microchip Technology. It represents a standard offering in their low-frequency power semiconductor portfolio, designed for general-purpose industrial applications requiring reliable high-current switching at medium voltage levels.
Replacement Considerations
Direct substitutes must match the 600 V / 150 A specification and SOT-227-4 footprint. Verify pinout compatibility and thermal characteristics before substitution.
