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Product Detailed Parameters
- Description:DIODE MODULE GP 1000V 60A ISOTOP
- Series:-
- Mfr:Microchip Technology
- Package:Tube
- Diode Configuration:2 Independent
- Technology:Standard
- Voltage - DC Reverse (Vr) (Max):1000 V
- Current - Average Rectified (Io) (per Diode):60A
- Voltage - Forward (Vf) (Max) @ If:2.8 V @ 60 A
- Speed:Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):235 ns
- Current - Reverse Leakage @ Vr:100 µA @ 1000 V
- Operating Temperature - Junction:-
- Mounting Type:Chassis Mount
- Package / Case:SOT-227-4, miniBLOC
- Supplier Device Package:ISOTOP®
- Grade:-
- Qualification:-
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Overview
The APT2X60DQ100J is a dual anti-parallel fast recovery epitaxial diode (FRED) module manufactured by Microchip Technology. It utilizes silicon technology and is housed in an SOT-227 package with screw mount installation. The device features a repetitive reverse voltage of 1000 V and an average forward current rating of 60 A per leg. It operates within a junction temperature range from -55°C to +175°C.
Feature Summary
- Dual anti-parallel configuration for bridge or push-pull applications
- Fast recovery epitaxial diode technology for high-speed switching
- High thermal stability with maximum junction temperature of 175°C
Applications
- High-frequency DC-DC converters
- Induction heating power supplies
- Uninterruptible power supply (UPS) systems
Procurement Notes
Verify the specific suffix J against the official Microchip datasheet to confirm pinout compatibility and mechanical dimensions. Ensure the ordering part number matches the exact voltage and current ratings required for the target circuit design before procurement.
Selection Notes
Select this component for circuits requiring high-voltage isolation and rapid reverse recovery characteristics. The SOT-227 package facilitates efficient heat dissipation through direct mounting to a heatsink, suitable for high-power density designs.
Part Context
This module belongs to the APT series of discrete semiconductor modules from Microchip Technology. It is designed as a robust solution for power electronics applications demanding reliable performance under high electrical stress and thermal loads.
Replacement Considerations
Consult official Microchip documentation for verified cross-reference part numbers. Do not substitute with generic equivalents without verifying electrical parameters and physical footprint compatibility.
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