APT75GN60BDQ2G

APT75GN60BDQ2G

$8.60
  • Description:IGBT TRENCH FS 600V 155A TO-247
  • Series:-

SKU:b91ba8c15025 Category: Brand:

  
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Product Detailed Parameters

  • Description:IGBT TRENCH FS 600V 155A TO-247
  • Series:-
  • Mfr:Microchip Technology
  • Package:Tube
  • IGBT Type:Trench Field Stop
  • Voltage - Collector Emitter Breakdown (Max):600 V
  • Current - Collector (Ic) (Max):155 A
  • Current - Collector Pulsed (Icm):225 A
  • Vce(on) (Max) @ Vge, Ic:1.85V @ 15V, 75A
  • Power - Max:536 W
  • Switching Energy:2.5mJ (on), 2.14mJ (off)
  • Input Type:Standard
  • Gate Charge:485 nC
  • Td (on/off) @ 25°C:47ns/385ns
  • Test Condition:400V, 75A, 1Ohm, 15V
  • Reverse Recovery Time (trr):25 ns
  • Operating Temperature:-55°C ~ 175°C (TJ)
  • Mounting Type:Through Hole
  • Package / Case:TO-247-3
  • Supplier Device Package:TO-247-3
  • Grade:-
  • Qualification:-

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APT75GN60BDQ2G

Overview

The APT75GN60BDQ2G is a single IGBT from Microchip Technology, utilizing Trench Field Stop technology. It features a maximum collector-emitter voltage of 600 V and is housed in a TO-247-3 package. The device supports a continuous collector current of 155 A at 25°C and handles up to 93 A under other conditions. Power dissipation reaches 536 W, with an operating temperature range spanning -55°C to +175°C.

Feature Summary

  • Employs Trench Field Stop technology for enhanced performance
  • Designed for high power dissipation applications
  • Supports wide operating temperature ranges

Applications

  • High frequency switching applications
  • Motor control systems
  • Power supply designs

Procurement Notes

Verify the specific datasheet version and ordering suffixes when sourcing. Confirm that the TO-247-3 package matches your thermal management requirements. Ensure compatibility with gate drive voltages specified in the official documentation before integration into your circuit design.

Selection Notes

Select this component for applications requiring robust 600 V blocking capability and high current handling. The Trench Field Stop architecture offers advantages in switching efficiency compared to standard plans. Consider the 536 W power dissipation rating for heatsink sizing and thermal interface material selection.

Part Context

This part belongs to Microchip's discrete IGBT portfolio, specifically the low-frequency single configuration series. It complements complementary diodes like the APT75DA60T1G in half-bridge configurations. The TO-247-3 form factor provides a balance between power density and ease of mounting in industrial equipment.

Replacement Considerations

Direct replacements include the APT75GN60SDQ2G within the same product family. Verify pinout compatibility and exact electrical parameters against the target application requirements before substituting.

APT75GN60BDQ2GAPT75GN60BDQ2G
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