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Product Detailed Parameters
- Description：MOSFET 2N-CH 600V 72A SP4
- Series：-
- Mfr：Microchip Technology
- Package：Bulk
- Technology：MOSFET (Metal Oxide)
- Configuration：2 N-Channel (Half Bridge)
- FET Feature：-
- Drain to Source Voltage (Vdss)：600V
- Current - Continuous Drain (Id) @ 25°C：72A
- Rds On (Max) @ Id, Vgs：35mOhm @ 36A, 10V
- Vgs(th) (Max) @ Id：3.9V @ 2mA
- Gate Charge (Qg) (Max) @ Vgs：518nC @ 10V
- Input Capacitance (Ciss) (Max) @ Vds：14000pF @ 25V
- Power - Max：416W
- Operating Temperature：-40°C ~ 150°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：SP4
- Supplier Device Package：SP4
- Grade：-
- Qualification：-
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Overview
The APTC60AM35SCTG is a discrete semiconductor module manufactured by Microchip Technology, utilizing silicon technology. It integrates CoolMOS and Schottky Barrier Diode (SBD) components within an SP4 package configuration. The device is designed for high-power applications requiring efficient switching and rectification capabilities.
Feature Summary
- Integrates CoolMOS FET and SBD technologies in a single module
- SP4 package design for direct heatsink mounting
- Optimized thermal performance with low junction-to-case resistance
Applications
- High-efficiency power conversion systems
- Industrial motor drives
- Uninterruptible power supplies (UPS)
Procurement Notes
Verify the specific suffix SCTG against the official Microchip datasheet to confirm the exact pinout and thermal characteristics. Ensure compatibility with existing PCB footprints and heatsinking requirements before integration. Cross-reference the latest product change notifications for any manufacturing updates.
Selection Notes
Select this module when high voltage blocking capability and low conduction losses are critical. The integrated SBD reduces reverse recovery losses compared to standard diodes. Evaluate thermal management solutions based on the specified junction-to-case thermal resistance values provided in the technical documentation.
Part Context
This component belongs to the APTC series of power modules from Microchip. It combines advanced MOSFET technology with fast-recovery diodes to improve system efficiency. The SP4 package offers a robust mechanical structure suitable for demanding industrial environments.
Replacement Considerations
Consult the official Microchip replacement guide or datasheet errata for verified substitute part numbers. Do not assume cross-compatibility with other series without verifying electrical parameters and pin configurations.
