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Product Detailed Parameters
- Description：MOSFET 3N-CH 600V 49A SP1
- Series：CoolMOS™
- Mfr：Microchip Technology
- Package：Bulk
- Technology：MOSFET (Metal Oxide)
- Configuration：3 N Channel (Phase Leg + Boost Chopper)
- FET Feature：-
- Drain to Source Voltage (Vdss)：600V
- Current - Continuous Drain (Id) @ 25°C：49A
- Rds On (Max) @ Id, Vgs：45mOhm @ 24.5A, 10V
- Vgs(th) (Max) @ Id：3.9V @ 3mA
- Gate Charge (Qg) (Max) @ Vgs：150nC @ 10V
- Input Capacitance (Ciss) (Max) @ Vds：7200pF @ 25V
- Power - Max：250W
- Operating Temperature：-40°C ~ 150°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：SP1
- Supplier Device Package：SP1
- Grade：-
- Qualification：-
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Overview
The APTC60AM45BC1G is a discrete semiconductor module manufactured by Microchip Technology, belonging to the CoolMOS power module family. It integrates six N-channel MOSFETs and associated Schottky diodes into a single SP1 package configuration. The device utilizes silicon technology and is designed for high-power switching applications requiring robust thermal management via baseplate mounting.
Feature Summary
- Integrates three-phase bridge topology with six N-channel MOSFETs
- Incorporates fast recovery Schottky barrier diodes for efficient commutation
- Utilizes CoolMOS technology for optimized switching performance
- Features baseplate mounting for effective heat dissipation
Applications
- Three-phase motor drives
- Induction heating systems
- Uninterruptible power supplies (UPS)
- Solar inverters
Procurement Notes
Verify the specific suffix BC1G against official Microchip documentation to confirm pinout and electrical characteristics. Ensure compatibility with existing PCB footprints or busbar connections for the SP1 package. Confirm RoHS compliance status through current datasheets before integration.
Selection Notes
Select this module for applications requiring integrated three-phase switching with low conduction losses. Evaluate thermal resistance requirements based on the baseplate mounting style. Compare total gate charge and output capacitance parameters against system switching frequency constraints to ensure optimal efficiency.
Part Context
This component is part of Microchip's CoolMOS discrete semiconductor module lineup, specifically designed for power conversion. It replaces discrete component solutions by providing a compact, reliable assembly for high-current three-phase circuits within industrial and renewable energy equipment.
Replacement Considerations
Consult official Microchip substitution guides for compatible modules within the APTC series. Verify that alternative parts match the SP1 package dimensions and electrical ratings exactly. Cross-reference datasheets for any changes in thermal characteristics or pin assignments.
