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Product Detailed Parameters
- Description：MOSFET 4N-CH 600V 39A SP3
- Series：-
- Mfr：Microchip Technology
- Package：Bulk
- Technology：MOSFET (Metal Oxide)
- Configuration：4 N-Channel (Full Bridge)
- FET Feature：-
- Drain to Source Voltage (Vdss)：600V
- Current - Continuous Drain (Id) @ 25°C：39A
- Rds On (Max) @ Id, Vgs：70mOhm @ 39A, 10V
- Vgs(th) (Max) @ Id：3.9V @ 2.7mA
- Gate Charge (Qg) (Max) @ Vgs：259nC @ 10V
- Input Capacitance (Ciss) (Max) @ Vds：7000pF @ 25V
- Power - Max：250W
- Operating Temperature：-40°C ~ 150°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：SP3
- Supplier Device Package：SP3
- Grade：-
- Qualification：-
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Overview
The APTC60HM70T3G is a Power MOSFET module from Microchip Technology, utilizing Silicon technology. It belongs to the PM-MOSFET-COOLMOS-SP3F product family and is housed in an SP3 package configuration. The device is designed for high-power switching applications requiring robust thermal performance and low conduction losses typical of CoolMOS technology.
Feature Summary
- Integrates COOLMOS SP3F technology for optimized switching efficiency
- Designed for screw-mount installation in power modules
- Utilizes silicon-based discrete semiconductor construction
Applications
- High-frequency power conversion systems
- Industrial motor drive inverters
- Uninterruptible power supply (UPS) units
Procurement Notes
Verify the specific suffix 'RT3G' against official Microchip documentation to confirm tape-and-reel packaging versus tube variations. Confirm RoHS compliance status directly with the manufacturer's current datasheet revision. Ensure the ordering part number matches the exact electrical specifications required for the target application circuit design.
Selection Notes
Select this component when designing circuits that require the specific thermal and electrical characteristics of the SP3F module form factor. Evaluate the continuous drain current and on-resistance parameters against the system's peak load requirements. Ensure the gate drive voltage limits are compatible with the COOLMOS SP3F input characteristics.
Part Context
This module is part of Microchip's broader portfolio of discrete power modules, specifically leveraging the COOLMOS technology platform. It serves as a key component in medium-to-high power electronic converters where efficient heat dissipation and compact mounting solutions are critical for system reliability and performance optimization.
Replacement Considerations
Consult Microchip's official cross-reference guides for verified substitutes within the APTC series. Ensure any replacement maintains compatibility with the SP3 mechanical footprint and electrical ratings.
