APTC80A15SCTG

Overview

The APTC80A15SCTG is a discrete semiconductor module manufactured by Microchip Technology, classified under MOSFET-SBD Modules. It utilizes Silicon technology and features a SP4 package configuration. The component integrates a dual-channel N-Channel MOSFET with a rated voltage of 800V and a continuous current capacity of 28A. This module combines power switching and rectification functions within a single compact form factor designed for high-efficiency power conversion applications.

Feature Summary

• Integrates dual-channel N-channel MOSFETs with Schottky barrier diodes in a unified module structure
• Utilizes SP4 packaging to facilitate efficient thermal management and board space optimization
• Employs silicon-based construction for robust performance in high-voltage power switching environments

Applications

• High-frequency power supply topologies requiring integrated switching and freewheeling
• Industrial motor drive systems utilizing half-bridge configurations
• Uninterruptible power supply (UPS) units demanding high reliability and efficiency

Procurement Notes

Verify the specific revision status and RoHS compliance details directly through official Microchip Technology documentation before integration. Confirm that the SP4 package dimensions align with the target PCB footprint. Ensure that thermal design parameters meet the operational requirements of the intended application environment to maintain device longevity and performance stability.

Selection Notes

Select this module when designing circuits that require an 800V blocking capability combined with a 28A current rating in a dual-channel configuration. The SP4 package offers a distinct mechanical profile compared to standard discrete packages, necessitating careful consideration of mounting constraints. Evaluate thermal resistance characteristics against the system's heat dissipation capabilities to ensure adequate cooling solutions are implemented.

Part Context

This component belongs to the APTC series of discrete semiconductor modules from Microchip Technology, which focus on combining MOSFET and SBD technologies. These modules are engineered to reduce parasitic inductance and improve switching performance compared to discrete component assemblies. The SP4 designation indicates a specific package style optimized for surface-mount assembly and thermal conductivity in power electronics designs.

Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided source material. Engineers should consult Microchip Technology's official cross-reference guides or contact technical support for validated alternatives. Direct replacement requires matching electrical ratings, package dimensions, and thermal characteristics to ensure circuit compatibility.