APTGF100DA120TG

Overview

The APTGF100DA120TG is a Non Punch Through (NPT) Fast IGBT power module manufactured by Microchip Technology. It features a single configuration with a collector-emitter breakdown voltage of 1200 V and a continuous collector current rating of 135 A at Tc = 25°C. The device operates within a junction temperature range of -40°C to 150°C and utilizes an SP4 isolated package. Key electrical parameters include a maximum gate-emitter voltage of ±20 V, a typical saturation voltage of 3.7 V at 100 A, and a maximum power dissipation of 568 W at Tc = 25°C.

Feature Summary

• Non Punch Through (NPT) Fast IGBT technology providing low voltage drop and low tail current for high-frequency operation up to 50 kHz.
• Integrated Kelvin emitter connection designed to facilitate easy drive circuit implementation.
• Symmetrical design with dedicated lead frames for power connections to achieve very low stray inductance.
• Internal NTC thermistor included for precise temperature monitoring.

Applications

• AC and DC motor control systems
• Switched Mode Power Supplies (SMPS)
• Power Factor Correction circuits

Procurement Notes

Verify the specific revision level against the latest official datasheet before procurement. Confirm that the SP4 package mounting torque requirements are met during assembly. Ensure proper electrostatic discharge handling procedures are followed, as the devices are sensitive to ESD. Cross-reference the manufacturer part number to ensure compatibility with existing system designs.

Selection Notes

Select this component when designing circuits requiring high switching frequencies up to 50 kHz. The positive temperature coefficient of VCEsat facilitates easy paralleling of multiple units. Verify thermal management capabilities against the specified junction-to-case thermal resistance values. Ensure the drive circuit can accommodate the required gate charge specifications for optimal switching performance.

Part Context

This module belongs to the NPT IGBT Power Module family from Microchip Technology. It is engineered for robust performance in industrial power conversion applications. The SP4 package provides an isolated design allowing direct mounting to heatsinks. The integration of internal protection features and low stray inductance supports reliable operation in demanding environments.

Replacement Considerations

No public confirmed substitute part numbers are available in the provided documentation. Evaluate alternative modules based on matching voltage ratings, current capacity, and package dimensions if substitution is required.

FAQ

What is the maximum operating frequency supported by this module?

The module supports switching frequencies up to 50 kHz due to its NPT Fast IGBT technology and low tail current characteristics.

How does the package design assist in drive circuit implementation?

The module incorporates a Kelvin emitter connection, which is specifically designed to facilitate easy and stable drive circuit implementation.

Is there internal temperature monitoring capability?

Yes, the module includes an internal NTC thermistor for accurate temperature monitoring.