APTGL90DSK120T3G

$54.15

Description：IGBT MODULE 1200V 110A 385W SP3
Series：-

SKU:60b9a721662b Category: IGBT Modules Brand: Microchip Technology

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Product introduction

Product Detailed Parameters

Description：IGBT MODULE 1200V 110A 385W SP3
Series：-
Mfr：Microchip Technology
Package：Bulk
IGBT Type：Trench Field Stop
Configuration：Dual Buck Chopper
Vce(on) (Max) @ Vge, Ic：2.25V @ 15V, 75A
Input：Standard
NTC Thermistor：Yes
Operating Temperature：-40°C ~ 175°C (TJ)
Mounting Type：Chassis Mount
Package / Case：SP3
Supplier Device Package：SP3
Voltage - Collector Emitter Breakdown (Max)：1200 V
Current - Collector (Ic) (Max)：110 A
Power - Max：385 W
Current - Collector Cutoff (Max)：250 µA
Input Capacitance (Cies) @ Vce：4.4 nF @ 25 V

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APTGL90DSK120T3G

Overview

The APTGL90DSK120T3G is a dual buck chopper IGBT module from Microchip Technology, utilizing Trench Field Stop technology. It features a maximum collector-emitter breakdown voltage of 1200 V and a continuous collector current of 90 A at 25°C. The package configuration is SP1-12 with screw mount installation. Maximum power dissipation is rated at 385 W, and the operating temperature range spans from -40°C to +100°C. The gate-emitter maximum voltage is specified at 20 V.

Feature Summary

Dual buck chopper configuration for efficient power conversion
Trench Field Stop technology for optimized switching performance
Screw mount packaging for robust mechanical integration

Applications

Industrial motor drives
Uninterruptible power supplies
Induction heating systems

Procurement Notes

Verify component authenticity through authorized Microchip distributors or direct channels. Confirm RoHS compliance status via official documentation before integration. Ensure thermal management solutions align with the specified 385 W power dissipation rating. Validate package dimensions against the SP1-12 specification sheet to guarantee proper mounting compatibility.

Selection Notes

Select this module for applications requiring high reliability in medium-power switching environments. The Trench Field Stop architecture offers improved switching characteristics compared to standard planar designs. Consider the 1200 V rating for systems operating within this voltage boundary. Evaluate thermal resistance requirements based on the specific ambient conditions and heat sink capabilities available in the target design.

Part Context

This component belongs to Microchip's APTGL series of high-speed IGBT modules. The series utilizes advanced silicon technology to deliver enhanced efficiency and ruggedness. The dual buck chopper topology allows for compact circuit designs in bidirectional power flow applications. It represents a continuation of Microchip's commitment to reliable power semiconductor solutions.