APTGLQ40H120T1G

APTGLQ40H120T1G

$54.71
  • Description:IGBT MODULE 1200V 75A 250W SP1
  • Series:-

SKU:243b9061b442 Category: Brand:

  
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Product Detailed Parameters

  • Description:IGBT MODULE 1200V 75A 250W SP1
  • Series:-
  • Mfr:Microchip Technology
  • Package:Bulk
  • IGBT Type:Trench Field Stop
  • Configuration:Full Bridge
  • Vce(on) (Max) @ Vge, Ic:2.4V @ 15V, 40A
  • Input:Standard
  • NTC Thermistor:Yes
  • Operating Temperature:-40°C ~ 175°C (TJ)
  • Mounting Type:Through Hole
  • Package / Case:SP1
  • Supplier Device Package:SP1
  • Voltage - Collector Emitter Breakdown (Max):1200 V
  • Current - Collector (Ic) (Max):75 A
  • Power - Max:250 W
  • Current - Collector Cutoff (Max):100 µA
  • Input Capacitance (Cies) @ Vce:2.3 nF @ 25 V

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APTGLQ40H120T1G

Overview

The APTGLQ40H120T1G is a dual IGBT module manufactured by Microchip Technology, designed for high-power switching applications. It features a maximum collector-emitter voltage of 1200V and operates with a continuous collector current of 75A at 25°C. The device utilizes silicon technology and is housed in an SP1 package with screw mount installation style. Key electrical parameters include a maximum gate-emitter voltage of 20V and a power dissipation rating of 250W. The module supports a wide operating temperature range from -40°C to +175°C, ensuring reliability in demanding industrial environments.

Feature Summary

  • Dual IGBT configuration optimized for high-efficiency power conversion
  • Robust thermal performance supporting extended operating temperatures up to 175°C
  • High voltage capability with 1200V blocking capacity for industrial applications

Applications

  • Industrial motor drives
  • High-power switching power supplies
  • Inverter systems

Procurement Notes

Verify the specific datasheet revision and ordering suffix to ensure compatibility with your design requirements. Confirm that the SP1 package dimensions and terminal layout match your PCB or busbar design. Check for any recent product change notifications regarding material composition or manufacturing location updates. Ensure that the thermal interface material selection aligns with the specified power dissipation limits.

Selection Notes

Select this component when a 1200V rated dual IGBT module is required for medium-power applications. Consider the 75A continuous current rating against your peak load requirements. Evaluate the SP1 package size constraints within your enclosure design. Compare the thermal resistance characteristics against alternative packages if space is limited. Verify that the gate drive voltage specifications are compatible with your control circuitry.

Part Context

This part belongs to Microchip's IGBT module portfolio, specifically utilizing advanced silicon technology for reliable power switching. The APTGLQ series is engineered for industrial-grade performance, offering a balance of voltage handling and current capacity. The SP1 package provides a compact solution for mounting on heatsinks, facilitating efficient heat dissipation in dense electronic assemblies.

Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation. Consult official Microchip resources for cross-reference information.

APTGLQ40H120T1GAPTGLQ40H120T1G
$54.71
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