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Product Detailed Parameters
- Description：IGBT MODULE 600V 150A 340W SP1
- Series：-
- Mfr：Microchip Technology
- Package：Bulk
- IGBT Type：Trench Field Stop
- Configuration：Half Bridge
- Vce(on) (Max) @ Vge, Ic：1.9V @ 15V, 100A
- Input：Standard
- NTC Thermistor：Yes
- Operating Temperature：-40°C ~ 175°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：SP1
- Supplier Device Package：SP1
- Voltage - Collector Emitter Breakdown (Max)：600 V
- Current - Collector (Ic) (Max)：150 A
- Power - Max：340 W
- Current - Collector Cutoff (Max)：250 µA
- Input Capacitance (Cies) @ Vce：6.1 nF @ 25 V
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Overview
The APTGT100A60T1G is a silicon IGBT module manufactured by Microchip Technology, housed in the SP1-12 screw-mount package. It features a half-bridge configuration with a maximum collector-emitter voltage of 600 V and a continuous collector current of 150 A at 25°C. The device exhibits a collector-emitter saturation voltage of 1.5 V and a power dissipation rating of 340 W. Gate-emitter leakage current is specified at 400 nA, with a maximum gate-emitter voltage of 20 V. Operating temperatures range from -40°C to +100°C.
Feature Summary
- Half-bridge topology for efficient switching applications
- Screw-mount installation for secure mechanical attachment
- SP1-12 standardized packaging format
Applications
- Industrial motor drives
- Uninterruptible power supplies
- Inverter circuits
Procurement Notes
Verify the specific suffix T1G against official Microchip documentation to confirm exact manufacturing lot attributes and compliance status. Confirm the SP1-12 package dimensions match the target thermal interface design. Ensure the 600V rating aligns with system voltage requirements including transient spikes.
Selection Notes
Select this component when a 150A half-bridge solution is required within the SP1-12 form factor. Compare the 1.5V saturation voltage against alternative packages if lower conduction losses are critical. Verify that the 340W power dissipation capability meets the thermal management constraints of the intended enclosure.
Part Context
This part belongs to the APTGT series of trench field-stop IGBT modules. It shares the SP1-12 package family with other variants like the APTGT150A60T1G, which offers higher current capacity. The series utilizes silicon technology optimized for industrial power conversion efficiency.
Replacement Considerations
The APTGT150A60T1G serves as a direct pin-compatible upgrade within the same SP1-12 package, offering increased current handling. Verify thermal resistance differences between the 100A and 150A variants before substitution.
