SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The APTGT100TL170G is a silicon IGBT module manufactured by Microchip Technology, designed for high-power applications. It features a half-bridge configuration within the SP6C package and supports screw mounting. The device operates with a maximum collector-emitter voltage of 1700 V and delivers a continuous collector current of 150 A at 25°C. Key electrical parameters include a collector-emitter saturation voltage of 1.5 V, a gate-emitter leakage current of 400 nA, and a power dissipation rating of 560 W. The module withstands a maximum gate-emitter voltage of 20 V and functions reliably within an operating temperature range from -40°C to +100°C.
Verify component authenticity by cross-referencing the manufacturer part number with official Microchip Technology documentation. Confirm that the specific package variant matches the required SP6C form factor for your design. Ensure that thermal interface materials and mounting hardware are compatible with the specified screw mount style. Check for any recent product change notices or errata sheets that may affect implementation details before finalizing procurement orders.
Select this module when designing systems requiring high voltage blocking capability combined with significant current handling capacity. The 1700 V rating makes it suitable for medium-voltage industrial applications where standard 600 V or 1200 V devices are insufficient. Consider the 150 A continuous current rating against your peak load requirements and thermal constraints. The Trench Field Stop technology offers advantages in switching speed and efficiency compared to older generation IGBTs.
This component belongs to the APTGT series of IGBT modules from Microchip Technology, which focuses on high-performance power electronics solutions. The series utilizes advanced silicon technology to deliver reliable operation in demanding environments. The APTGT100TL170G represents a specific configuration within this lineup, tailored for applications requiring high voltage isolation and substantial power throughput in compact packaging formats.
Public confirmed substitute part numbers are not available in the provided source material.