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Product Detailed Parameters
- Description：IGBT MODULE 600V 225A 480W SP4
- Series：-
- Mfr：Microsemi Corporation
- Package：Bulk
- IGBT Type：Trench Field Stop
- Configuration：Dual, Common Source
- Vce(on) (Max) @ Vge, Ic：1.9V @ 15V, 150A
- Input：Standard
- NTC Thermistor：Yes
- Operating Temperature：-40°C ~ 175°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：SP4
- Supplier Device Package：SP4
- Voltage - Collector Emitter Breakdown (Max)：600 V
- Current - Collector (Ic) (Max)：225 A
- Power - Max：480 W
- Current - Collector Cutoff (Max)：250 µA
- Input Capacitance (Cies) @ Vce：9.2 nF @ 25 V
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Overview
The APTGT150DU60TG is a dual-source IGBT module manufactured by Microsemi Corporation. It features a 600V collector-emitter voltage rating and a continuous collector current of 225A at 25°C. The device utilizes Trench technology with an SP4 package, offering a maximum power dissipation of 480W. It includes an integrated NTC thermistor for thermal management and supports chassis mounting within an operating temperature range of -40°C to 175°C.
Feature Summary
- Dual-source configuration for bridge applications
- Integrated NTC thermistor for precise thermal monitoring
- Trench IGBT technology for optimized switching performance
Applications
- Industrial motor drives
- Uninterruptible power supplies (UPS)
- Inverter systems
Procurement Notes
Verify the specific datasheet revision and manufacturing origin when sourcing this component. Confirm that the supplier provides traceability documentation consistent with Microchip Technology standards. Ensure the physical condition matches the SP4 package specifications and check for any product change notifications related to the discontinued status or supply chain updates from the original manufacturer.
Selection Notes
Select this module for high-current applications requiring robust thermal management and fast switching characteristics. The dual-source design simplifies circuit topology for three-phase bridges. Consider the 600V rating and 225A current capacity against the specific load requirements and thermal constraints of the target system environment.
Part Context
This component belongs to the Microsemi Power Modules family, specifically designed for high-power conversion applications. It represents the transition period where Microsemi's discrete and module products were integrated into Microchip Technology's portfolio. The SP4 package is standard for medium-to-high power industrial modules.
Replacement Considerations
Public confirmed substitute part numbers are not available in the provided data. Consult official Microchip Technology cross-reference guides for compatible alternatives.
