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Product Detailed Parameters
- Description：IGBT MODULE 600V 225A 480W SP1
- Series：-
- Mfr：Microchip Technology
- Package：Bulk
- IGBT Type：Trench Field Stop
- Configuration：Single
- Vce(on) (Max) @ Vge, Ic：1.9V @ 15V, 150A
- Input：Standard
- NTC Thermistor：Yes
- Operating Temperature：-40°C ~ 175°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：SP1
- Supplier Device Package：SP1
- Voltage - Collector Emitter Breakdown (Max)：600 V
- Current - Collector (Ic) (Max)：225 A
- Power - Max：480 W
- Current - Collector Cutoff (Max)：250 µA
- Input Capacitance (Cies) @ Vce：9.2 nF @ 25 V
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Overview
The APTGT150SK60T1G is a single IGBT module manufactured by Microchip Technology, utilizing silicon trench field-stop technology. It features a maximum collector-emitter voltage (VCEO) of 600 V and a continuous collector current of 225 A at 25°C. The device exhibits a collector-emitter saturation voltage of 1.5 V and a gate-emitter leakage current of 400 nA. With a power dissipation rating of 480 W, it operates within a temperature range of -40°C to +100°C. The component is housed in an SP1-12 screw-mount package.
Feature Summary
- Single configuration with trench field-stop IGBT technology
- Screw mount installation style for secure mechanical attachment
- SP1-12 package design optimized for thermal management
Applications
- Industrial motor drives
- Power supply systems
- Inverter circuits
Procurement Notes
Verify the specific datasheet revision and ordering suffix when sourcing this component. Confirm that the SP1-12 package dimensions match the target PCB or heatsink interface requirements. Ensure the supplier provides original manufacturer documentation to validate authenticity and technical specifications before integration into designs.
Selection Notes
Select this module for applications requiring a single high-current switch with 600 V blocking capability. The 225 A continuous current rating supports substantial load demands. Consider the 480 W power dissipation limit during thermal design. Verify compatibility with standard gate drive voltages and ensure adequate cooling solutions are implemented for the screw-mount package.
Part Context
This part belongs to the Microchip APTGT series of IGBT modules. These components are designed for medium-power switching applications. The series offers various configurations including single, half-bridge, and full-bridge options. The APTGT150SK60T1G specifically addresses needs for robust single-switch performance in industrial environments.
Replacement Considerations
Direct substitutes require matching 600 V, 225 A, and SP1-12 package specifications. Evaluate alternative single IGBT modules from other manufacturers with comparable trench field-stop technology and thermal characteristics. Ensure pinout compatibility and electrical parameters align with existing circuit designs.
