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Product Detailed Parameters
- Description：IGBT MODULE 600V 225A 480W SP6P
- Series：-
- Mfr：Microchip Technology
- Package：Bulk
- IGBT Type：Trench Field Stop
- Configuration：Three Phase
- Vce(on) (Max) @ Vge, Ic：1.9V @ 15V, 150A
- Input：Standard
- NTC Thermistor：No
- Operating Temperature：-40°C ~ 175°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：SP6
- Supplier Device Package：SP6-P
- Voltage - Collector Emitter Breakdown (Max)：600 V
- Current - Collector (Ic) (Max)：225 A
- Power - Max：480 W
- Current - Collector Cutoff (Max)：250 µA
- Input Capacitance (Cies) @ Vce：9.2 nF @ 25 V
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Overview
The APTGT150TA60PG is a silicon-based IGBT module manufactured by Microchip Technology, housed in an SP6-P screw-mount package. It features a three-phase configuration with a maximum collector-emitter voltage of 600 V and a continuous collector current of 225 A at 25°C. The saturation voltage is 1.9 V at 150 A, with a power dissipation rating of 480 W. Operating temperatures range from -40°C to +175°C junction temperature. Key electrical parameters include a gate-emitter leakage current of 250 µA and an input capacitance of 9.2 nF at 25 V.
Feature Summary
- Utilizes trench field-stop technology for efficient switching performance.
- Designed for three-phase inverter applications requiring robust thermal management.
- Features a standard gate input configuration compatible with common driver circuits.
Applications
- Industrial motor drives
- Uninterruptible power supplies (UPS)
- Induction heating systems
Procurement Notes
Verify the specific suffix PG against official datasheets to confirm packaging details, as suffixes may indicate variations in tape-and-reel or tube formats. Confirm RoHS compliance status directly with the manufacturer's latest documentation before procurement. Ensure the supplier provides valid traceability records for quality assurance purposes.
Selection Notes
Select this component when a 600V three-phase IGBT module with 225A continuous current capability is required. The SP6-P package offers a balance of current density and thermal performance. Verify that the application's thermal design can handle the 480W power dissipation rating under worst-case operating conditions.
Part Context
This part belongs to the APTGT series of high-power IGBT modules from Microchip Technology. The series utilizes advanced trench field-stop technology to optimize switching losses and conduction characteristics. The SP6-P package is a standardized form factor within the portfolio, facilitating integration into various industrial power conversion designs.
Replacement Considerations
Direct replacements must match the 600V/225A/SP6-P specifications. Cross-reference pinouts and thermal pad dimensions with alternative manufacturers' equivalent three-phase modules to ensure mechanical compatibility without redesigning the heatsink interface.
