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Product Detailed Parameters
- Description：IGBT MODULE 600V 400A 940W D3
- Series：-
- Mfr：Microchip Technology
- Package：Bulk
- IGBT Type：Trench Field Stop
- Configuration：Single
- Vce(on) (Max) @ Vge, Ic：1.9V @ 15V, 300A
- Input：Standard
- NTC Thermistor：No
- Operating Temperature：-40°C ~ 175°C (TJ)
- Mounting Type：Chassis Mount
- Package / Case：D-3 Module
- Supplier Device Package：D3
- Voltage - Collector Emitter Breakdown (Max)：600 V
- Current - Collector (Ic) (Max)：400 A
- Power - Max：940 W
- Current - Collector Cutoff (Max)：500 µA
- Input Capacitance (Cies) @ Vce：18.5 nF @ 25 V
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Overview
The Microchip Technology APTGT300DA60D3G is a single-configuration IGBT module utilizing silicon technology. It features a maximum collector-emitter voltage of 600 V and a continuous collector current of 400 A at 25°C. The device exhibits a collector-emitter saturation voltage of 1.5 V and a gate-emitter leakage current of 400 nA. Maximum power dissipation is rated at 940 W, with a maximum gate-emitter voltage of 20 V. The component operates within a temperature range of -40°C to +125°C and is housed in a D3-11 package designed for screw mount installation.
Feature Summary
- Single configuration IGBT module construction
- Screw mount installation style for secure mechanical attachment
- Silicon-based semiconductor technology
Applications
- Industrial motor drives
- Power conversion systems
- Inverter circuits
Procurement Notes
Verify the specific datasheet revision and RoHS compliance status directly with Microchip Technology or authorized distributors before procurement. Confirm that the D3-11 package dimensions match the target thermal management design. Ensure the supply chain source provides valid traceability documentation for this specific part number to guarantee authenticity and quality standards.
Selection Notes
Select this component when a single IGBT switch with 600 V blocking capability and 400 A current handling is required. The D3-11 package facilitates direct mounting to heatsinks via screws. Verify that the system's thermal design can accommodate the 940 W power dissipation rating under expected operating conditions and junction temperature limits.
Part Context
This module belongs to the PM-IGBT-TFS-D3 product family from Microchip Technology. It represents a standard trench field-stop IGBT technology implementation. The D3-11 packaging format is commonly used in medium-power industrial applications requiring robust mechanical mounting and efficient heat transfer to external cooling structures.
Replacement Considerations
Direct replacements must match the 600 V, 400 A, single IGBT specification and D3-11 footprint. Evaluate alternative Microchip models such as APTGT300SK60D3G for potential pinout or parameter variations. Cross-reference with other manufacturers' equivalent modules only if mechanical and electrical specifications are identical.
