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The APTGT300DU170G is a silicon-based IGBT module manufactured by Microchip Technology, housed in an SP6 screw-mount package. It features a dual configuration with a maximum collector-emitter voltage of 1.7 kV and a continuous collector current of 400 A at 25°C. The device exhibits a collector-emitter saturation voltage of 2 V and a gate-emitter leakage current of 600 nA. Maximum power dissipation is rated at 1.66 kW, while the maximum gate-emitter voltage is 20 V. The operational temperature range spans from -40°C to +100°C, and the unit weighs approximately 110 g.
Verify the specific revision status against the latest Product Change Notification documents provided by Microchip Technology prior to finalizing design-in decisions. Confirm that the SP6 package dimensions and terminal configurations match the target PCB or busbar layout requirements exactly. Ensure that the ordering suffix corresponds to the intended RoHS compliance level as specified in the official datasheet documentation.
Select this component when a dual IGBT topology is required within the 1.7 kV voltage class. The SP6 package offers a standardized footprint for screw mounting, facilitating heat sink integration. Designers should account for the 2 V saturation voltage when calculating conduction losses at the rated 400 A current level. Verify that the system's thermal management can handle the 1.66 kW dissipation limit under worst-case operating conditions.
This part belongs to the Microchip APTGT series of high-power IGBT modules. The 'DU' designation indicates a dual configuration, distinguishing it from single ('DA') or other variants within the same voltage and current family. These modules are engineered for industrial power electronics applications where reliability and high current density are critical performance factors.
Direct functional substitutes within the same package include the APTGT300A170G, which shares identical electrical ratings and the SP6 housing. Cross-package replacements require careful evaluation of mechanical mounting interfaces and pinout compatibility.