APTGT50A170TG

$74.99

Description：IGBT MODULE 1700V 75A 312W SP4
Series：-

SKU:e8d4d60bbf42 Category: IGBT Modules Brand: Microchip Technology

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Product introduction

Product Detailed Parameters

Description：IGBT MODULE 1700V 75A 312W SP4
Series：-
Mfr：Microchip Technology
Package：Bulk
IGBT Type：Trench Field Stop
Configuration：Half Bridge
Vce(on) (Max) @ Vge, Ic：2.4V @ 15V, 50A
Input：Standard
NTC Thermistor：Yes
Operating Temperature：-40°C ~ 150°C (TJ)
Mounting Type：Chassis Mount
Package / Case：SP4
Supplier Device Package：SP4
Voltage - Collector Emitter Breakdown (Max)：1700 V
Current - Collector (Ic) (Max)：75 A
Power - Max：312 W
Current - Collector Cutoff (Max)：250 µA
Input Capacitance (Cies) @ Vce：4.4 nF @ 25 V

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APTGT50A170TG

Overview

The APTGT50A170TG is a Trench Field Stop (TFS) IGBT module manufactured by Microchip Technology. It features a dual configuration housed in an SP4 chassis mount package. The device supports a maximum collector-emitter voltage of 1.7 kV and a continuous collector current of 75 A at 25°C. Key electrical parameters include a saturation voltage of 2 V, power dissipation of 312 W, and a gate-emitter leakage current of 600 nA. The module operates within a temperature range of -40°C to +100°C and utilizes silicon technology.

Feature Summary

Incorporates Trench Field Stop technology for optimized switching performance
Designed as a half-bridge configuration for efficient power conversion
Utilizes robust SP4 packaging for reliable thermal management

Applications

Industrial motor drives
Uninterruptible power supplies
High-frequency inverters

Procurement Notes

Verify the specific suffix 'TG' against official Microchip documentation to confirm exact pinout and thermal interface specifications. Ensure that the SP4 mounting requirements align with the target application's mechanical constraints. Cross-reference the datasheet for precise thermal resistance values to validate heat sink design adequacy before procurement.

Selection Notes

Select this component for applications requiring high voltage blocking capability up to 1.7 kV. The 75 A current rating suits moderate power density designs. Consider the TFS technology benefits for reduced switching losses compared to standard field-stop variants. Evaluate the SP4 package dimensions against available board space and cooling infrastructure.

Part Context

This part belongs to the APTGT series of IGBT modules from Microchip Technology. It represents a discrete power semiconductor solution designed for medium-power industrial applications. The series emphasizes reliability and efficiency through advanced trench field stop architecture, distinguishing it from older planar or standard field-stop technologies.