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The APTGT50DH60T1G is a silicon IGBT module manufactured by Microchip Technology, housed in the SP1-12 screw-mount package. It features an asymmetrical bridge configuration with a maximum collector-emitter voltage of 600 V and a continuous collector current of 80 A at 25°C. The device exhibits a collector-emitter saturation voltage of 1.5 V and a gate-emitter leakage current of 600 nA. Power dissipation is rated at 176 W, while the maximum gate-emitter voltage is 20 V. Operating temperatures range from -40°C to +100°C.
Verify the exact suffix T1G against official Microchip documentation to confirm packaging and tape-and-reel specifications. Ensure the SP1-12 footprint matches the target PCB design. Confirm RoHS compliance status through the manufacturer's latest environmental declaration before finalizing procurement orders.
Select this component when a 600V asymmetrical bridge topology is required within the SP1-12 form factor. The 80A continuous current rating suits moderate-power applications. Verify thermal management capabilities align with the 176W dissipation rating and the specified operating temperature range of -40°C to +100°C.
This module belongs to the APTGT series of trench field-stop IGBT modules from Microchip Technology. It shares the SP1-12 package style with other variants like the APTGT30H60T1G but differs in internal configuration as an asymmetrical bridge rather than a full bridge.
Direct substitutes include other APTGT series modules in the SP1-12 package, such as the APTGT50DDA60T3G, provided the electrical ratings and pinout compatibility are verified against the specific application requirements.