APTGT50TDU170PG

Overview

The APTGT50TDU170PG is a silicon IGBT module manufactured by Microchip Technology, housed in an SP6P screw-mount package. It features a triple dual common source configuration with a maximum collector-emitter breakdown voltage of 1700 V and a continuous collector current of 70 A at 25°C. The device exhibits a collector-emitter saturation voltage of 2 V and a power dissipation rating of 310 W. Operating within a temperature range of -40°C to +100°C, it includes a gate-emitter leakage current of 400 nA and a maximum gate-emitter voltage of 20 V.

Feature Summary

• Triple dual common source configuration for high-power switching applications
• High-voltage capability with 1700 V collector-emitter breakdown rating
• Robust thermal management supporting up to 310 W power dissipation
• Wide operating temperature range from -40°C to +100°C

Applications

• Industrial motor drives
• Power conversion systems
• Inverter circuits

Procurement Notes

Verify the specific datasheet revision and electrical characteristics directly from Microchip Technology documentation before integration. Confirm that the SP6P package dimensions and mounting requirements align with the target design constraints. Ensure compliance with RoHS standards as indicated in official product specifications. Cross-reference part numbers to avoid confusion with similar variants such as the APTGT50TDU60PG or APTGT50DH170TG which differ significantly in voltage and current ratings.

Selection Notes

Select this component for applications requiring high voltage isolation and medium-to-high current handling capabilities. The triple dual common source structure offers flexibility in circuit topology compared to standard single or dual configurations. Consider the 1700 V rating for robustness against voltage spikes in inductive loads. Evaluate the 70 A continuous current limit against peak load requirements to ensure reliable operation within the specified thermal envelope.

Part Context

This IGBT module belongs to Microchip's PM-IGBT-TFS-SP6P series, designed for efficient power switching in demanding environments. The SP6P package provides a standardized footprint for screw-mount installation, facilitating integration into existing industrial power electronics platforms. As a silicon-based device, it balances performance and cost for general-purpose high-power applications.

Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. Designers should consult Microchip Technology directly for qualified alternatives or cross-reference options based on specific electrical and mechanical compatibility requirements.