APTGX300HR170G

APTGX300HR170G

$200.42
  • Description:PM-IGBT-TFS-SP6C
  • Series:-

SKU:3c5bcedc58ec Category: Brand:

  
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Product Detailed Parameters

  • Description:PM-IGBT-TFS-SP6C
  • Series:-
  • Mfr:Microchip Technology
  • Package:Bulk
  • IGBT Type:-
  • Configuration:Three Level Inverter
  • Vce(on) (Max) @ Vge, Ic:2V @ 15V, 300A
  • Input:Standard
  • NTC Thermistor:No
  • Operating Temperature:-40°C ~ 175°C (TJ)
  • Mounting Type:Chassis Mount
  • Package / Case:Module
  • Supplier Device Package:-
  • Voltage - Collector Emitter Breakdown (Max):1700 V
  • Current - Collector (Ic) (Max):385 A
  • Power - Max:1.034 kW
  • Current - Collector Cutoff (Max):25 µA
  • Input Capacitance (Cies) @ Vce:31300 pF @ 25 V

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APTGX300HR170G

Overview

The Microchip Technology APTGX300HR170G is a silicon-based IGBT power module featuring a T-type dual common emitter configuration. It operates with a maximum collector-emitter voltage of 1700 V and delivers a continuous collector current of 385 A at 25°C. The device exhibits a collector-emitter saturation voltage of 1.7 V and supports a power dissipation of 1034 W. Designed for robust performance, it functions within a temperature range of -40°C to +175°C and utilizes screw mount installation.

Feature Summary

  • Utilizes Trench 7 IGBT technology for high-speed switching capabilities
  • Features a T-type dual common emitter configuration for efficient circuit integration
  • Designed specifically for three-level inverter applications

Applications

  • Three-level inverter systems
  • Industrial motor drives
  • Uninterruptible power supplies (UPS)
  • Medium voltage variable frequency drives

Procurement Notes

Verify the specific datasheet revision and package variant before procurement, as Microchip may update specifications or manufacturing locations. Confirm that the screw mount interface matches your thermal management system requirements. Ensure compatibility with gate drive voltages specified in the official documentation to prevent device damage during operation.

Selection Notes

Select this component when designing systems requiring high voltage isolation and significant current handling capacity. The T-type configuration offers distinct advantages for neutral-point-clamped topologies compared to standard half-bridge modules. Evaluate thermal resistance characteristics against your heatsink design to ensure junction temperatures remain within the specified operational limits under peak load conditions.

Part Context

This part belongs to the APTGX series of high-performance IGBT modules from Microchip Technology. It represents an evolution in power semiconductor packaging, combining advanced silicon carbide-compatible designs with traditional silicon IGBTs. The series targets demanding industrial and traction applications where reliability and efficiency are critical parameters for system longevity.

Replacement Considerations

Direct replacements must match the 1700V rating, 385A current capability, and SP6C package dimensions. Verify pinout compatibility and thermal interface specifications. Cross-reference with other Microchip T-type modules or equivalent industry standards ensuring identical electrical characteristics and mounting constraints.

APTGX300HR170GAPTGX300HR170G
$200.42
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