APTGX75TA170TPG

APTGX75TA170TPG

$138.99
  • Description:PM-IGBT-TFS-SP6P
  • Series:-

SKU:b3d4c6689676 Category: Brand:

  
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Product Detailed Parameters

  • Description:PM-IGBT-TFS-SP6P
  • Series:-
  • Mfr:Microchip Technology
  • Package:Bulk
  • IGBT Type:-
  • Configuration:Three Phase
  • Vce(on) (Max) @ Vge, Ic:2V @ 15V, 75A
  • Input:Standard
  • NTC Thermistor:Yes
  • Operating Temperature:-40°C ~ 175°C (TJ)
  • Mounting Type:Chassis Mount
  • Package / Case:Module
  • Supplier Device Package:-
  • Voltage - Collector Emitter Breakdown (Max):1700 V
  • Current - Collector (Ic) (Max):120 A
  • Power - Max:382 W
  • Current - Collector Cutoff (Max):10 µA
  • Input Capacitance (Cies) @ Vce:7600 pF @ 25 V

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APTGX75TA170TPG

Overview

The APTGX75TA170TPG is a silicon IGBT power module manufactured by Microchip Technology. It features a three-phase configuration housed in the SP6P package with screw mount installation. The device supports a maximum collector-emitter voltage of 1.7 kV and delivers a continuous collector current of 120 A at 25°C. Key electrical parameters include a collector-emitter saturation voltage of 1.7 V, gate-emitter leakage current of 150 nA, and maximum power dissipation of 382 W. The unit operates within a temperature range of -40°C to +175°C and has a maximum gate-emitter voltage rating of 20 V.

Feature Summary

  • Three-phase inverter topology for multi-leg power conversion
  • High-voltage capability suitable for industrial drive applications
  • Integrated thermal management via baseplate mounting

Applications

  • Industrial motor drives
  • Uninterruptible power supplies
  • Induction heating systems

Procurement Notes

Verify component authenticity through authorized Microchip Technology distributors or direct manufacturer channels. Confirm RoHS compliance status using official documentation before integration. Ensure supply chain partners provide valid traceability records. Cross-reference datasheet revisions to confirm parameter consistency. Validate packaging integrity upon receipt to prevent mechanical damage during handling.

Selection Notes

Select this module for high-voltage three-phase applications requiring robust switching performance. Evaluate thermal resistance characteristics against system heat sink capabilities. Verify gate drive voltage compatibility with the 20 V maximum rating. Consider the SP6P package dimensions for PCB or chassis layout constraints. Assess short-circuit withstand time requirements against application fault conditions.

Part Context

This component belongs to the Microchip APTGX series of high-power IGBT modules. The series utilizes trench field-stop technology for optimized switching losses. The SP6P package provides a standardized footprint for three-phase configurations. This specific part number denotes the 1.7 kV voltage class variant within the lineup.

Replacement Considerations

Direct pin-compatible substitutes are not explicitly confirmed in public documentation. Evaluate alternative Microchip SP6P packages with matching voltage and current ratings. Verify thermal interface material compatibility when swapping modules. Check gate threshold voltage similarities to ensure driver circuit compatibility.

APTGX75TA170TPGAPTGX75TA170TPG
$138.99
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